Taipei, Monday, March 2, 2015 15:43 (GMT+8)
light rain
Applied Materials to accelerate TSV adoption in 3-dimensional ICs
Photo: Company [Dec 2, 2008]
Applied Materials to accelerate TSV adoption in 3-dimensional ICs

Applied Materials has announced that it is leading a major effort to enable the widespread adoption of through-silicon vias (TSVs), an approach for vertically stacking integrated circuits (ICs) to boost chip performance and functionality in a smaller area.

TSVs enable applications such as DDR4 DRAM memories and future communications and mobile internet chips.

Since the biggest roadblock to implementing TSVs is cost, Applied is working internally and with other equipment suppliers to develop an integrated, high-performance on-wafer process flow to lower the cost, reduce the risk and accelerate time to market for customers.

2015 global AP market forecast and vendor analysis
DIGITIMES Marketing Services
DIGITIMES Translation Services
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • Greater China touch panel shipment forecast through 2015

    This Special Report provides forecasts through 2015 for Greater China touch panel shipments with breakdowns based on technology (glass, film, resistive), application (smartphone, NB and tablet) and by firm.

  • 2014 global tablet demand forecast

    This report analyzes the main players, their strategies and shipments forecasts for 2014, as well as other factors contributing to either growth or decline in various segments within the tablet market, with a particular focus on Apple, Google, Samsung, and Microsoft, along with whitebox vendors.