Bits + chips
ASE projects flip-chip crossover in 2005
Amy Lee, Kaohsiung; Jack Lu, DIGITIMES

Flip-chip packaging will become one of the mainstream technologies used for logic chips next year as the costs of using the technology approach the levels of the other less advanced BGA packaging, according to Ho-Ming Tong, vice president of advanced...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.