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Bits + chips
Samsung claims heat dissipation reduction by 20% in new LCD driver IC package
Press release, February 1; Esther Lam, DIGITIMES
Samsung Electronics announced that its thermally-enhanced chip-on-film (TECOF) package for LCD driver ICs that are used in large-size and high-resolution LCD TVs could improve thermal heat dissipation by 20% over a conventional COF package, allowing...
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