Samsung Electronics announced its official financial results for the second quarter of 2025, reporting revenue of KRW74.6 trillion (US$53.5 billion) and an operating profit of KRW4.7 trillion, consistent with preliminary figures. Compared to the same period in 2024, revenue remained roughly flat, but operating profit was halved, with Samsung attributing the decline primarily to weak performance in its semiconductor business.
More than two decades after being pushed out of the chip industry, LG Electronics is making a surprise return—this time with its sights set on one of the most advanced tools in high-performance memory: hybrid bonding equipment for high-bandwidth memory, or HBM. Often referred to as a "dream tool" in the industry, the move signals LG's renewed ambition to reclaim a spot in a field it once helped shape.
Samsung Electronics is reportedly pushing back the mass production of its next-gen high-bandwidth memory (HBM) chips to 2026, signaling a more cautious rollout amid ongoing DRAM redesign efforts.
