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Tuesday 9 September 2025

Micron's 12-high HBM yield performance surpasses 8-high

The high bandwidth memory (HBM) market has become one of the most competitive arenas in the semiconductor industry, with Micron Technology signaling its confidence in its position. Micron Technology reports its 2026 HBM output is already sold out, underscoring the company's confidence in its market position as demand intensifies.

Tuesday 9 September 2025

Samsung to double GDDR7 output following Nvidia B40 order

Nvidia has reportedly placed an order with Samsung Electronics for GDDR7 graphics memory, with the supply volume doubling compared to previous orders. Samsung's GDDR7 was previously used in the China-market-specific AI accelerator B40, drawing significant attention to the ongoing collaboration between Samsung and Nvidia.

Monday 8 September 2025

US weighs annual China chip supply approvals for Samsung, SK Hynix

The US is proposing annual approvals for exports of chipmaking supplies to Samsung Electronics and SK Hynix's factories in China, a compromise aimed at preventing disruptions to the global electronics industry after Trump officials revoked Biden-era waivers that let the companies more easily get such shipments.

Monday 8 September 2025

Samsung reportedly resumes construction on Pyeongtaek P5 to advance HBM4 mass production plans

Samsung Electronics is reportedly accelerating the construction of its fifth plant (P5) in Pyeongtaek, South Korea.

Monday 8 September 2025

Semicon Taiwan 2025 sets new records, focusing on AI, advanced packaging, and memory

SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies across 4,100 booths. The event is projected to attract more than 100,000 visitors, setting a new record in scale.

Monday 8 September 2025

Rebellions become billion-dollar battleground for Samsung, SK Hynix

Rebellions, a rising South Korean AI chipmaker, has become a focal point in the rivalry between Samsung Electronics and SK Hynix as the two giants compete for leadership in next-generation semiconductors, putting the startup's strategy under intense scrutiny.

Monday 8 September 2025

Micron targets Galaxy LPDDR5X, pressuring Samsung supply

Micron Technology is rumored to be significantly increasing its share of low-power DRAM supply for Samsung Electronics' Galaxy S series smartphones. South Korean industry insiders believe that if Micron becomes the largest DRAM supplier for the Galaxy S series, Samsung's own semiconductor and Device Solutions (DS) division will face reduced DRAM supply volume. This potential shift is raising concerns among market watchers.

Monday 8 September 2025

Weekly news roundup: Rapidus 2nm matches TSMC density and outpaces Intel; TSMC to hike chip prices up to 10% in 2026

These are the most-read DIGITIMES Asia stories from the week of September 1–September 7.

Monday 8 September 2025

South Korea's MCP exports to Taiwan surge, debunking AI bubble concern and boosting SK Hynix outlook

South Korea's multi-chip packaging (MCP) exports continued to climb sharply in August 2025, with the share of high-bandwidth memory (HBM) exports to Taiwan steadily increasing.

Saturday 6 September 2025

Micron bets on culture and ecosystem strength in high-stakes HBM battle

Micron is sharpening its case in the high-bandwidth memory (HBM) market, where it faces entrenched rivals and rising competition.

Friday 5 September 2025

Exclusive: NAND flash rally gains steam with SanDisk's 10% price hike

SanDisk is spearheading a fresh round of NAND flash price hikes, issuing an exclusive notice of a 10% increase across all channels and consumer products starting September 4. The decision comes as supply tightens and demand from AI servers and enterprise storage accelerates. Industry sources told DIGITIMES Asia this marks the opening salvo in a new pricing cycle, with rival chipmakers widely expected to follow. SanDisk said further adjustments are under review for the coming quarters.

Friday 5 September 2025

OpenAI reportedly developing custom AI chips with Broadcom, mass output slated for 2026

Broadcom CEO Hock Tan revealed the company has landed a US$10 billion order from a mystery customer, which insiders now identify as OpenAI. The two firms are developing OpenAI's first custom artificial intelligence (AI) processor, scheduled to enter mass production in 2026.

Friday 5 September 2025

South Korea's Nextin expands China operations as G2 strains deepen

While geopolitical tensions push many companies away from China, South Korean chip equipment maker Nextin is doubling down with a new factory in Wuxi, betting big on a market that generates over 80% of its revenue.

Friday 5 September 2025

Samsung and SK Hynix reportedly delay DDR4 phase-out as older chips prove more profitable than DDR5

Samsung Electronics and SK Hynix are reportedly pushing back plans to phase out DDR4 DRAM, extending production until 2026 after prices for the older chips surged past next-generation DDR5. Both companies declined to comment on the reports.

Friday 5 September 2025

Samsung enters HBM4 race with aggressive pricing to win Nvidia supply deal

To reshape the high-bandwidth memory (HBM) market landscape, Samsung Electronics is reportedly set to engage in a "game of chicken" once again. According to the latest reports from South Korean media, Samsung is producing sixth-generation HBM (HBM4) samples on an unprecedented scale and plans to adopt a low pricing strategy to secure a place in Nvidia's supply chain.

Thursday 4 September 2025

Commentary: YMTC's 3D DRAM push challenges CXMT and global memory leaders

China's push to localize its memory supply chain is gathering momentum. YMTC has begun trial production at its first fully localized NAND flash fab, while market chatter indicates the company is now quietly investing in DRAM. The move underscores YMTC's ambition to extend beyond NAND dominance, using its patented Xtacking technology to break into DRAM and challenge the world's top three players.

Thursday 4 September 2025

Korean industry sees US VEU revocations as rare earth talk leverage

Analysts say the US government's decision to revoke Verified End-User (VEU) authorizations for semiconductor equipment exports to Samsung Electronics and SK Hynix's Chinese factories appears primarily aimed at gaining leverage in negotiations over rare earths with China. VEU permits allow pre-approved companies to import US technology without case-by-case license applications, and the withdrawal on August 31, 2025, has raised concerns about potential disruptions to semiconductor production in China.

Thursday 4 September 2025

Tech Forum 2025: ASICs, packaging, and HBM reshape the AI chip race

The global market for high-end cloud AI accelerators is approaching a major turning point. DIGITIMES forecasts that beginning in 2026, the supply chain will enter a new "decentralized" phase shaped by three forces: the expansion of custom ASICs, diversification of advanced packaging, and intensifying competition in high-bandwidth memory (HBM) pricing.

Wednesday 3 September 2025

SK Hynix installs first high-NA EUV lithography system at Icheon fab

SK Hynix announced that it has successfully assembled the industry's first high-NA extreme ultraviolet (EUV) lithography system for mass production at its M16 fabrication plant in Icheon, South Korea.

Tuesday 2 September 2025

SK Hynix strikes pay deal, lifting average worker bonus to US$78,600

SK Hynix ended a protracted labor dispute by scrapping a ceiling on worker bonuses, easing the risk of strikes after nearly three months of wage talks.

Tuesday 2 September 2025

China's YMTC moves into DRAM, teams with CXMT to target HBM market

Yangtze Memory Technologies Corp. (YMTC), China's largest NAND flash producer, is expanding into the DRAM sector as part of Beijing's broader drive to compete in advanced memory markets like high-bandwidth memory (HBM). Industry sources indicate YMTC could begin investing in DRAM equipment by late 2025, while actively pursuing a strategic partnership with domestic DRAM leader ChangXin Memory Technologies (CXMT).

Tuesday 2 September 2025

SK Hynix expected to outpace Samsung, Micron in HBM share

SK Hynix is expected to retain more than half of the global high-bandwidth memory (HBM) market through at least 2027, cementing its role as Nvidia's top supplier while broadening its reach across the memory semiconductor spectrum, according to forecasts cited by South Korean media, including Business Post, ZDNet Korea, and Yonhap.

Tuesday 2 September 2025

US strips Samsung, SK Hynix of China exemptions, dealing major blow to Korean chipmakers

The US Commerce Department plans to revoke long-standing waivers that have allowed Samsung Electronics and SK Hynix to operate their Chinese chip plants using American equipment. The new rules, set to take effect within 120 days, heighten tensions between Washington and Beijing while putting South Korea in a difficult position.

Tuesday 2 September 2025

Samsung and SK Hynix VEU exemption revocation opens door for Micron and Chinese chipmakers

On August 29, 2025, local time, the US Department of Commerce (DOC) announced it will revoke the Validated End-User (VEU) exemptions previously granted to South Korean manufacturers Samsung Electronics and SK Hynix for using US-made semiconductor equipment in their China-based factories.

Tuesday 2 September 2025

Hanwha Semitech advances fluxless bonding to address HBM packaging strains

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to address the challenge with advanced fluxless bonding tools, targeting the market for HBM4 and beyond.

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