The age of Artificial Intelligence (AI) at the edge is here, companies cannot wait to showcase their solutions and AI PC products at Computex 2024, which will be hosted from June 4-7. Paradoxically, industry experts at the AI PC Industry Exploration Forum on May 16 predicted the phrase "AI PC" or "AI smartphones" will be obsolete in a few years.

The internet giants are building comprehensive ecosystems, in which Generative AI (GenAI) plays a pivotal role. "From cloud to the edge" will be an inevitable trend.

Moore's Law is not advancing as fast as it used to be under 2nm and even into the Angstrom level, and competitors are trying to catch up. Can ASML, the Dutch semiconductor equipment maker, continue its monopolistic leadership in the extreme ultraviolet (EUV) lithography equipment market?

Zinite is seeking to shake up the semiconductor industry through innovations in transistor architecture to achieve more chip performance density. Founded by Gem Shoute, Douglas Barlage, and Kenneth Cadien, and seeking to meet the demands of HPC, AI, and AGI by accelerating 3D chip adoption, Zinite's core technology is a thin-film transistor (TFT) with CMOS-level drive current and a large temperature process window, including channel material processing stability at 400C.

Etron Technology, along with its multiple subsidiaries, held a press conference before COMPUTEX 2024.

Due to the increasing competitiveness of end-use products, industries from semiconductors, electronic components to assembly plants, have faced challenges in improving yield rates and boosting production speeds.

Orders from China's semiconductor firms may be turning strong.

Applied Materials revealed that its revenue from GAA process equipment is expected to increase significantly over the next 1-2 years, indicating that TSMC's 2nm GAA chips will likely enter mass production as scheduled. 2025 will also see head-to-head competition among major chipmakers at this most advanced technology.

Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into volume production by 2030, according to industry sources.

An explosion from a chemical truck at Taiwan Semiconductor Manufacturing Co.'s construction site in Arizona killed the driver, according to statements from a local construction union and the Phoenix Police Department.

Taiflex Scientific, a specialist in flexible PCB materials such as flexible copper clad laminates (FCCL), celebrated the grand opening of its Thailand plant on May 15 at the Amata City Chonburi Industrial Estate.