The price of South Korea's semiconductor exports rose at a record pace in May, underscoring the strength of an AI rally powering the country's economic momentum.
Synopsys has announced that its AI-driven digital design and analog design flows have achieved certification on Samsung Foundry's SF2 process with multiple test chip tape-outs.
Kunlunxin, a spin-off of Baidu's chip and architecture department, has just received investments from Beijing's Municipal AI Industry Investment Fund. It is the sixth AI-related investment by the government fund.
Egis Technology has entered into an exclusive partnership agreement with Fingerprint Cards (Fingerprints), one of the world's top biometric sensor solution providers, allowing Egis to acquire Fingerprints' mobile product lines and technology.
Fan-out panel-level (FOPLP) packaging is gaining attention from semiconductor firms seeking extra capacity support, and two AI chip companies are in talks with OSATs about potential business opportunities, according to industry sources.
Taiwan's Central Bank announced to raise the Gross Domestic Product (GDP) growth rate forecast for the entire year of 2024 to 3.77% in the second quarter's quarterly Monetary Policy meeting, up from 3.22% predicted in the first quarter.
Cloud AI not only received major attention at Computex 2024 but the network communication chip business opportunities arising from cloud AI data centers were also further pushed to the forefront and became the talk of the town. This is mainly because major chipmakers like Nvidia, AMD, Intel, and even MediaTek, all mentioned various network communication technologies required for cloud AI in their keynote speeches.
IC distributor and OEM Audix held its shareholder meeting on June 12, during which Audix Group chairman and president Chung Yuan-Kai shared his optimistic outlook for 5G NR/6G communications, Wi-Fi 6E/7 networking, EV and e-bikes, and automotive electronics testing.
Taiwan is expected to witness a significant surge in the number of data centers and supercomputers in the next few years, which will result in high electricity consumption.
The AI wave is propelling the semiconductor industry towards new growth momentum. Besides companies directly supplying and manufacturing AI PCs and AI servers, IC distributors are now recognizing the strong demand for High-Performance Computing (HPC).
Thanks to a 280% growth in AI revenue, Broadcom announced robust financial results for its second quarter of fiscal 2024, prompting an upward revision of its fiscal year 2024 guidance.
High-speed transmission chip specialist Parade Technologies expects AI PCs to drive upcoming opportunities for growth as demand for high-end retimer chips increases, says chairman Jack Zhao. Furthermore, order visibility has improved compared to a month ago, especially in terms of PC-related products.
The still-valid exclusive deal between Microsoft and Qualcomm for the supply of Arm chips for Windows PCs has prompted MediaTek to remain mute on the development of its AI PC chips, according to market sources.
Sony's automotive CMOS Image Sensor (CIS) business is rapidly growing due to increasing demand for cameras in automobiles and the need for better image quality and functionality. This growth has inspired the company to announce its goal of making its automotive CIS business profitable by fiscal year 2026 (April 2026-March 2027).
ElevATE Semiconductor and GlobalFoundries (GF) have announced a manufacturing partnership for high-voltage chips produced at GF's facility in Essex Junction, Vermont. Designed by ElevATE and manufactured at scale by GF on its proven and power-efficient 7HV technology platform, the chips are vital to commercial semiconductor testing equipment and critical applications for aerospace and defense systems.
TSMC's board of directors decided to donate up to NT$4 billion (US$123.6 million) to top universities and high schools for semiconductor research and talent education at a meeting on June 5.
Samsung Electronics is actively expanding its partner alliance to strengthen its semiconductor packaging technology, seeking to compete with the world's leading foundry, TSMC, in this field.
Vietnam's semiconductor landscape is evolving rapidly, with the central region emerging as a new destination for foreign semiconductor firms, complementing the established chipmaking cluster in the north and the burgeoning software and IC design hub in the south. According to DIGITIMES Research, ongoing global geopolitical tensions, Vietnam's abundant local talent pool, and its policy initiatives to achieve a balanced development across regions will continue shaping the country's semiconductor ecosystem.
FOCI Fiber Optic Communications has announced the issuance of 5,000,000 common stock via private placement financing, with Himax Technologies serving as a strategic investor.
