Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Malaysian Prime Minister Anwar Ibrahim announced the National Semiconductor Strategy (NSS), with the government allocating MYR25 billion (US$5.3 billion) to foster industry develop...
Nvidia is reportedly planning to adopt Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips ahead of schedule, aimed at addressing the tight production capacity...
Optical film packaging and CMOS image sensor (CIS) back-end manufacturer VisEra held its shareholder meeting and board of directors election on May 22.
While the US-China technology rivalry and the resultant G2 framework have prompted the semiconductor industry to diversify production risks, Vietnam is emerging as an attractive location...
PCB and semiconductor equipment specialist Csun Manufacturing plays an important role in the supply chain for advanced 2.5D and 3D IC packaging, said company president Frank Liang...
TSMC has started producing Tesla's next-generation Dojo AI training tiles with its InFO_SoW (Integrated Fan-Out System-on-Wafer) technology, aiming for a 40x increase in computing...
Canon's semiconductor equipment business, despite representing only 7.5% of its revenue in the fiscal year 2023 (January 2023 to December 2023), achieved a profit margin of 18.6%,...
Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into...
Amidst endeavors to cultivate a semiconductor ecosystem, India is purportedly contemplating creating an IP pool for semiconductor startups, mirroring the approach adopted by Taiwan...
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
