Rapidus chairman Tetsuro Higashi said the Japanese pure-play foundry that aims to mass-produce 2nm chips could achieve its revenue target 10 years earlier than planned, as the AI...
Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing...
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon...
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Chiplet technology is being embraced as a major semiconductor trend as Moore's Law slows down, but there are still many challenges during the design process.
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit...
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
The global chiplets market is forecast to be worth around US$107 billion by 2033, up from US$3.1 billion in 2023, with a CAGR of 42.5% between 2024 and 2033. It is projected to be...
TSMC and Samsung Electronics are gearing up for a chiplet mass production race. Both industry giants are set to materialize the commercialization of UCIe (Universal Chiplet Interconnect...
The Institute of Computing Technology of the Chinese Academy of Sciences recently published a paper in the journal Fundamental Research introducing their "Big Chip" archit...
