Supply chain
Highlights of the day: TSMC positive outlook lifts semiconductor supply chain
DIGITIMES staff

TSMC's positive outlook for the rest of 2019 has lifted the cloud over the semiconductor supply chain. For passive component makers, business improvements may not come right away, but they are banking on 5G applications - a key factor underlying TSMC's optimism - to revive their momentum. And smatphone vendors are rolling out devices that can take fully support the 5G market, with many of them looking to feature OLED displays in their offerings. China-based panel maker BOE is poised to become a major OLED handset panel supplier.

IC backend supply chain buoyed by TSMC positive 3Q19 outlook: Taiwan-based IC backend supply chain players are optimistic about their performance prospects for the second half of 2019 in line with TSMC's positive outlook about demand for high-end mobile APs from smartphone vendors and high-performance computing (HPC) chips form datacenter operators, according to industry sources.

Taiwan passive components makers actively moving to develop 5G RF, antenna products: Lackluster terminal market demand has prompted Taiwan's leading passive components makers Yageo and Walsin Technology to step up implementing new development roadmaps for the next decade, focusing on 5G wireless communication components such as RF (radio frequency) and antenna solutions as well as automotive electronics devices through acquisition deals and internal resources integration, according to industry sources.

BOE ranks 2nd in global AMOLED handset panel shipments in 1Q19: BOE Technology managed to become second largest vendor in terms of global AMOLED handset panel shipments in first-quarter 2019 thanks to continued orders from Huawei for its flagship smartphone models, according to industry observers.

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