Taipei, Wednesday, September 20, 2017 13:58 (GMT+8)
partly cloudy
Taipei
35°C
Digitimes Research: USB 3.1 still cannot replace HDMI and Thunderbolt for Ultra HD transmissions
Danny Kuo, DIGITIMES Research, Taipei [Thursday 29 May 2014]

The USB 3.1 standard has significantly raised the transmission speed to 10Gbps, up from the 5Gbps for USB 3.0, but the technology will still struggle to replace HDMI and Thunderbolt for Ultra HD image transmissions, according to Digitimes Research.

Following the announcement of USB 3.1 technological standards in July 2013, IC design houses are now expected to begin rolling out engineering samples of USB 3.1 host controller and peripheral chips in the second half of 2014 for evaluation by system providers, Digitimes Research noted.

However, since the transmission of Ultra HD images requires a transmission speed of 12Gbps, the 10Gbps USB 3.1 can only support Ultra HD video at half vertical refresh rates, said Digitimes Research.

Additionally, HDMI 2.0 will upgrade speeds to 18Gbps from the previous 10.2Gbps, while Thunderbolt 2 will also ramp speeds from the previous 10Gbps to 20Gbps. Both HDMI 2.0 and Thunderbolt 2 will fully support Ultra HD transmissions, with their markets unaffected by the roll-out of USB 3.1 technology, commented Digitimes Research.

Content from this article was part of a complete Digitimes Research Chinese-language report that has not yet been translated into English. If you are interested in an English version of the report or wish to receive more information about the report, click here to contact us and we will get back to you as soon as possible. Digitimes Research also provides quarterly tracking services for market sectors such as Global Tablet, China Smartphone, China Smartphone AP, Taiwan ICT and Taiwan FPD. Click here for more information about Digitimes Research Tracking services.

Realtime news
  • Leading-edge paves way for pure-play foundry growth, says IC Insights

    Bits + chips | 3min ago

  • Intel reschedules Cannon Lake launch to year-end 2018, say sources

    IT + CE | 6min ago

  • Synopsys tapes out DesignWare, Interface IP for TSMC 7nm FinFET process

    Bits + chips | 25min ago

  • EIH, Plastic Logic strengthen e-paper partnership

    Displays | 27min ago

  • Taiwan market: CHT teams up with Fox+ to provide OTT service

    Mobile + telecom | 32min ago

  • NAND flash supply to stay tight til end-2017, says Phison chairman

    Bits + chips | 35min ago

  • Touch Taiwan 2017: Corning showcases advanced glass technologies

    Displays | 37min ago

  • Intel provides 10nm updates, plan for 10nm FPGA

    Bits + chips | 3h 9min ago

  • Acer reveals marketing budget increase for gaming notebook biz

    Before Going to Press | Sep 19, 22:02

  • Touch Taiwan 2017: ITRI to showcase flexible display, touch technologies

    Before Going to Press | Sep 19, 21:43

  • Touch Taiwan 2017: GIS to highlight smart touch panel solutions

    Before Going to Press | Sep 19, 21:42

  • India PV module firms tapping overseas markets

    Before Going to Press | Sep 19, 21:08

  • Synopsys tapes out DesignWare, Interface IP for TSMC 7nm FinFET process

    Before Going to Press | Sep 19, 20:49

Pause
 | 
View more
UMC
Global AP demand forecast, 2017-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.