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News tagged USB 3.1
  • Last update: Friday 3 July 2015 [12 news items]

ASMedia may be impacted by AMD poor performance

9h 48min ago

ASMedia Technology, which has received orders from AMD for its southbridge chip R&D and manufacturing, may feel the impact of AMD's poor peformance in the PC industry recently,...

ASMedia expects great 2H15 from USB 3.1 business

Jun 4, 22:00

Commenting on the USB 3.1 business, president of Taiwan-based connector chip design house ASMedia Chewei Lin pointed out that although Intel has delayed the launch of its next-generation...

Computex 2015: ASRock to showcase latest gaming products; AMD focuses on new processors

Jun 2, 16:00

ASRock is showcasing its latest products at Computex 2015 and will unveil its 100-series chipset-based motherboard the Z170 Extreme7, built with alloy materials and supporting DDR4...

USB 3.1 Type-C to become the new high-speed transmission standard

Jun 2, 15:54

The announcement of the new MacBook at an Apple Event in spring 2015 was notable as device only offers a single USB Type-C port.

Genesys Logic sees net profits up 115% on year in 1Q15

Newswatch - May 13, 22:23

USB chip supplier Genesys Logic has reported net profits of NT$83 million (US$2.7 million) for the first quarter of 2015, down 34% sequentially but up 115% from a year earlier.

AMD to launch Godavari APUs at end of May, say Taiwan makers

Apr 27, 11:04

AMD will launch Godavari series APUs at the end of May to compete with Intel's Broadwell and Skylake platforms, according to Taiwan-based supply chain makers.

ASMedia leads in USB 3.1 controller ICs amid Taiwan IC designers

Mar 3, 20:27

ASMedia Technology, among Taiwan-based IC design houses, has taken the initiative to offer USB 3.1 controller ICs and has won adoption by Asustek Computer and ASRock for new motherboards...

Asustek to launch motherboards with USB 3.1 at end of February

Feb 12, 19:55

Asustek Computer will take the initiative to launch motherboard with support for USB 3.1 at the end of February, according to Taiwan-based supply chain makers.

Shipments of USB 3.1 peripherals and chips to take off in 1H15

Dec 24, 22:49

Shipments of PC peripherals and chips supporting USB 3.1 standards are set to take off in the first half of 2015 due to the support of USB 3.1 interfaces by Microsoft, Intel, Apple...

Faraday and Fresco Logic jointly develop 55nm USB 3.1 host controller, says report

Stockwatch - Dec 23, 10:37

IC design service provider Faraday Technology and Fresco Logic, a fabless semiconductor company delivering SuperSpeed USB connectivity solutions, have jointly developed a 55nm USB...

ASMedia to sample USB 3.1 to SATA controller chips in August

Jun 6, 15:20

USB controller maker ASMedia will begin to sample USB 3.1 to SATA device controller chips in August 2014, according to company president Chewei Lin.

ASMedia president Chewei Lin

Digitimes Research: USB 3.1 still cannot replace HDMI and Thunderbolt for Ultra HD transmissions

May 29, 16:01

The USB 3.1 standard has significantly raised the transmission speed to 10Gbps, up from the 5Gbps for USB 3.0, but the technology will still struggle to replace HDMI and Thunderbolt...

Taiwan server shipment forecast and industry analysis, 2015
2015 global tablet demand forecast

3-Jul-2015 markets closed

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Analysis of China revised domestic semiconductor industry goals
  • Wireless broadband developments in Southeast Asia markets

    As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

  • 2015 global tablet demand forecast

    This Digitimes Research Special Report provides a 2015 forecast for the global tablet market and analyzes the strategies of key market players such as Google, Apple, Intel, and Microsoft.

  • 2015 China smartphone panel trend forecast

    This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.