Micron, TE Connectivity announce new reduced-height memory solution for ultra-thin market
Press release; Jessie Shen, DIGITIMES
Micron Technology and TE Connectivity have jointly announced the availability of a single-sided SODIMM and a low-profile single-sided DDR3 SODIMM connector solution to take advantage of the burgeoning market for ultrabook devices, convertibles, tablets...
The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
The coronavirus outbreak has disrupted production and weakened consumer confidence, with all ICT sectors bracing for major declines in shipments. Digitimes Research has conducted analyses on three mobile device sectors, namely notebooks, smartphones and tablets in the wake of the outbreak.