VIA reportedly volume ships ULV solutions for Samsung Q1P UMPC
Commercial Times, September 12; Jessie Shen, DIGITIMES

The Chinese-language Commercial Times reported that VIA Technologies has kicked off volume shipments of 100,000 ULV (ultra low voltage) solutions, the VIA C7-M processor and VX700 chipset, for the Samsung Q1P Ultra Mobile PC (UMPC). VIA on...

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