Bits + chips
UMC to break ground for new R&D center at TSIP
EDN, February 14; Emily Chuang, DIGITIMES

Taiwanese foundry United Microelectronics Corporation (UMC) will break ground for its new R&D center at the Tainan Science-Based Industrial Park (TSIP) on February 16, according to the Chinese-language Economic Daily News (EDN).

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