Bits + chips
ASE shipping DDR2 substrate to client in Europe, company to double its flip-chip substrate capacity
Amy Lee, Taipei; Jack Lu, DIGITIMES

Advanced Semiconductor Engineering (ASE) has started shipping PBGA substrate to a Europe-based DRAM maker this quarter. The company also plans to more than double its flip-chip substrate capacity next year.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.