Bits + chips
Demand for flip-chip packaging to grow in 4Q 2004, pending substrate prices: sources say
Amy Lee, Taipei; Jack Lu, DIGITIMES

The migration from ball-grid array (BGA) to flip-chip (FC) packaging may accelerate in the fourth quarter of next year, if prices for FC turnkey services drop to about US$3.60 per chip from the US$4-5 range currently, according to sources.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.