Bits + chips
PCB makers see new business opportunities in Intel Montevina platform
Ingrid Lee, Taipei; Joseph Tsai, DIGITIMES

With Intel planning to adopt high-density interconnect (HDI) PCB boards for its next generation Montevina notebook platform, notebook vendors such as Dell have recently contacted Taiwan PCB suppliers with the expectation that around 25% of shipments...

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
Realtime news
© 2020 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.