Wuhan Xinxin Semiconductor Manufacturing Co. (XMC), a key subsidiary of YMTC, is under growing regulatory scrutiny as its once-promising bid for a STAR Market listing unravels into a drawn-out saga of earnings collapse, mounting depreciation, and tangled related-party dealings, according to reports from CLS, TMTPost, and Caixin.

Samsung Electronics is reportedly ramping up investment in extreme ultraviolet (EUV) lithography, planning to add five more systems for its memory division alongside two high-numerical-aperture (High NA) EUV tools for its foundry arm. The move positions Samsung for the anticipated memory supercycle, as DRAM and high-bandwidth memory (HBM) manufacturers race to expand next-generation production capacity.

TSMC will build two advanced packaging plants in Arizona, part of a sweeping expansion to support soaring demand for AI chips and solidify its strategic presence in the US, Chairman and CEO C.C. Wei announced during the company's latest earnings call.

As demand for artificial intelligence (AI) continues to surge through 2025 and non-AI end markets show mild recovery, TSMC chairman C.C. Wei has raised the company's full-year revenue guidance once again.

Broadcom on Thursday introduced the industry's first suite of Wi-Fi 8 silicon solutions, signaling a new era in wireless connectivity engineered specifically for the demands of artificial intelligence (AI)-driven edge networks.