Montage Technology, a Chinese manufacturer of memory interface devices and PCIe retimer chips, is collaborating with H3C, a Tsinghua Unigroup-affiliated company, to promote Compute...
China's autonomous driving startup Momenta reportedly has recruited the Oppo-disbanded Zeku chip design team to support its in-house chip development, and has also partnered with...
Anticipated growth in the energy storage system market is centered on key regions like the U.S., China, and Europe, driven by the global push for increased renewable energy installations...
Qualcomm has extended its partnership with Sony to provide future smartphones powered by Snapdragon platforms, according to the chipmaker. The companies agreed to collaborate on future...
Lockheed Martin and GlobalFoundries (GF) have announced a strategic collaboration to advance semiconductor manufacturing and innovation in the United States and to enhance the security,...
Despite some market observers' optimism about the recovery of the memory market in the second half of 2023, Taiwan-based memory module maker Team Group and NAND controller chip maker...
Touch module maker TPK has disclosed plans to form a joint venture with HD Renewable Energy (HDRE) to develop and produce energy storage systems and charging piles for electric vehicles...
Nidec and Renesas Electronics have agreed to collaborate on the development of semiconductor solutions for a next-generation e-axle (X-in-1 system) that combines an electric vehicle...
Taiwan-based First International Computer (FIC) announced it is teaming up with Finland-based supplier of augmented reality (AR) software Basemark to develop automotive mixed reality...
Memory module and SSD vendor Team Group reportedly recently landed a large-volume B2B memory module order from an international ODM, according to industry sources.
MediaTek has announced a partnership with Nvidia to deliver a complete range of in-vehicle AI cabin solutions for the next generation of software-defined vehicles.
EDA specialist Synopsys has recently announced its collaboration with TSMC to deliver digital and custom design EDA flows on the foundry's most advanced N2 (2nm) process, aiming to...
Infineon Technologies and Hon Hai Technology (Foxconn) have signed an agreement to work on silicon carbide (SiC) development for electric vehicles (EV).
Arm and Intel Foundry Services (IFS) have announced a multigeneration collaboration in which chip designers will be able to build low-power system-on-chips (SoC) using Intel 18A technology...
