Samsung Electronics is reportedly promoting Molded Underfill (MUF) materials in its advanced packaging processes. Since SK Hynix has already adopted MUF technology for its High Bandwidth...
SK Hynix plans to invest KRW2 trillion ($1.5 billion) in 2024 to introduce extreme ultraviolet (EUV) lithography equipment to cope with the new generation of memory investment in...
The memory market has rebounded from the previous trough, led by NAND Flash's multi-fold price surge. However, the NAND business of many integrated device manufacturers (IDMs) is...
SK Hynix is reported to commence mass production of the fifth-generation High Bandwidth Memory (HBM) HBM3E in March 2024, once again leaping ahead of competitors Samsung Electronics...
With the surge in demand for generative AI training over the past few quarters, Nvidia's performance has shown a significant leap, benefiting various supply chain players and emerging...
Leading in the high-bandwidth memory (HBM) market, SK Hynix aims to maintain its technological competitiveness by unveiling its industry-leading HBM3E technology, which stacks 16...
The memory industry has rebounded from the price trough. Although the long Lunar New Year holiday affected customers' willingness to have goods shipped earlier, and the global economy...
Japanese NAND flash memory maker Kioxia has reported a significant net loss of JPY254 billion (approximately US$1.7 billion) in the first three quarters of fiscal year 2023 (April...