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Tuesday 10 September 2024
Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Monday 9 September 2024
AI boom drives silicon photonics era, Taiwan seizes opportunities via international partnerships
The burgeoning AI industry is accelerating the arrival of the silicon photonics (SiPh) era, and Taiwan's industry is actively promoting various integration efforts to seize the growing...
Monday 9 September 2024
Eaton leverages local edge to address power demands amid data center expansion in Taiwan
The rise of artificial intelligence (AI) is driving major tech companies like AWS, Google, Microsoft, and NVIDIA to rapidly expand their presence. Their establishment of data centers...
Friday 6 September 2024
Dutch tech powers next-gen manufacturing, from chips to cloud
Several Dutch companies showcased cutting-edge technologies at SEMICON Taiwan 2024, contributing to advancements in semiconductor manufacturing and data center infrastructure.
Friday 6 September 2024
Semiconductor giants unveil sustainability roadmaps at Semicon Taiwan 2024
Taiwan's semiconductor industry, a linchpin of the global tech supply chain, is grappling with an existential challenge: how to maintain growth while dramatically reducing its environmental...
Friday 6 September 2024
TV panel sales to slow in 4Q24
The fourth quarter of 2024 is expected to see a decrease in the sales of TV panels, which has prompted major suppliers to reduce their output to sustain pricing, according to industry...
Friday 6 September 2024
WinWay sees co-packaged optics ready for mass production by 2026
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Friday 6 September 2024
ASE establishes SiPhIA consortium, CEO Tien Wu sees accelerated progress in silicon photonics
Leading IC packaging and testing company, ASE, has been consistently highlighting silicon photonics (SiPh) as a future trend since the latter half of 2023. CEO Dr. Tien Wu stated...
Friday 6 September 2024
Acer gearing up for AI PC boom
Acer chairman and CEO Jason Chen expects the popularity of AI PCs to explode, driving demand for hardware and software, with AI PCs expected to make up about 90% of Acer's product...
Friday 6 September 2024
Foxconn expects revenue growth in 3Q24
Hon Hai Technology Group (Foxconn) has disclosed that its revenue decreased sequentially by 4.2% in August. However, the company remains optimistic that its revenue will increase...
Friday 6 September 2024
Advanced packaging material sales to skyrocket in 2025, says Topco Scientific
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Thursday 5 September 2024
Cobalt recycling gains attention amid speculation on export restrictions
Cobalt is essential for producing lithium-ion batteries and is extensively used in electric vehicles, computers, and smartphones. As demand for electric vehicles rises, global cobalt...
Thursday 5 September 2024
Chinese server giant Inspur scores record revenue in 1H24 amid AI boom, but gross margin dips to new low
Riding the wave of the booming artificial intelligence (AI) industry, China's leading server maker, Inspur Electronics Information Industry, reported a record-high revenue of over...
Thursday 5 September 2024
CHPT's AI initiative drives revenue growth and innovation in chip-testing solutions
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...
Thursday 5 September 2024
IC material supplier Wah Lee sees robust demand for CoWoS packaging
Wah Lee Industrial, which distributes photoresist and CMP slurries, and other front-end process manufacturing materials, expects robust demand for CoWoS packaging to drive significant...
CPC
Summary of Tech Supply Chain News!
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research