Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Apple's competitors in the handset market are making conservative production plans for next year, as they have yet to see a clear picture of 2024, according to sources at OSATs.
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
The 2023 EU-Taiwan Investment Partnership Forum on Semiconductor Clusters, taking place on Sep. 7 on the sidelines of SEMICON Taiwan, saw new dynamics injected following the passage...
The explosive growth of global network data driven by both cloud AI and edge AI brings significant challenges to the existing cloud infrastructure and edge computing architecture...
OSAT ASE Technology reportedly is seeking to secure chip-on-wafer (CoW) packaging certification from Nvidia for its Kaohsiung plant in southern Taiwan, according to industry source...
OSATs ASE Technology and King Yuan Electronics (KYEC), both of which reportedly are in the supply chain for Nvidia's AI chips, are likely to experience revenue declines in 2023 despite...
Chinese OSATs with support from government subsidies have reduced their prices further in an effort to secure more orders, whereas first-tier semiconductor backend services providers...
Taiwan's mobile phone chips backend supply chain players have recently expressed pessimism about the handset application market outlook. Major OSATs ASE Technology and King Yuan Electronics,...
The era of software-defined automobiles is approaching, and while electronic control units (ECUs) are becoming more streamlined, the computing and integration capabilities of the...
All the new iPhone series for 2023 are very likely to feature Dynamic Island display technology, but Taiwanese partners in the supply chain, such as camera modules...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
Semiconductor backend houses, such as leading OSAT ASE Technology Holdings (ASEH) and test interface specialist Chunghwa Precision Test Tech (CHPT), are expected to see sales growth...
OSATs could still be digesting inventory in their wafer banks for some handset applications in 2024 if handset brand vendors continue to see weak sales, according to industry sourc...
Amid the ongoing US-China trade war, Chinese communication system giants such as Huawei and ZTE have taken a low-key approach on the international stage, but back in their home country,...
