Taiwan-based flexible PCB specialists Zhen Ding Technology and Flexium Interconnect will both see revenues generated from antenna modules shipments for Apple devices grow substantially...
PCB makers in the supply chain of iPhones are expected to see only limited growth in ASPs this year due to insignificant specs upgrades in SLP (substrate-like PCB) mainboards for...
The supply of BT substrates is likely to fall short of demand in the second half of this year, but the shortage will be less severe than that of ABF substrates, according to industry...
CCL demand for 5G base station applications in the US and Europe are not expected to take off until 2022 at the earliest, according to industry sources.
Taiwan's flexible PCB (FPCB) suppliers Zhen Ding Technology and Flexium Interconnect are expected to post robust sales for second-quarter 2021, mainly bolstered by shipments to Apple...
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
Taiwan PCB and CCL makers in the supply chain of Apple smartphones are gearing up production for new iPhones, with delivery schedules returning to pre-pandemic timeframes, according...
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Smartphone-use antenna makers are gearing up for a likely boom in demand for 5G AiP (antenna in package) modules that they expect will be triggered by Apple's release of new mmWave-enabled...
Flexible PCB maker Flexium Interconnect is set to start volume shipments of LCP (liquid crystal polymer) antenna boards for new iPhones in the second half of the year, which will...
ASE Technology Holding will see its FC-AiP (antenna in package) business receive a significant boost in the months ahead as the company and its EMS subsidiary Universal Scientific...
Apple is stepping up development its own dual-band 5G AiP (antenna in package) module, which, along with Qualcomm's solutions, may be featured in its next-generation iPhones, according...
IC substrate makers in Apple's iPhone supply chain are aggressively bracing for production of BT-based AiP (antenna in package) substrates expecting a surge in demand for new iPhones...
Taiwan-based FCCL manufacturers including Taiflex Scientific and Asia Electronic Material (AEM) have posted strong on-year revenue increases for the first quarter of 2021 thanks to...
Taiwan-based PCB makers are expected to see their combined output value grow further in 2021, driven by strong demand for IC substrates, HDI boards and flexible PCBs, according to...
