Micron Technology has started customer sampling of its new 192GB SOCAMM2 (Small Outline Compression Attached Memory Module), a low-power DRAM module designed for AI data centers.
As global demand for AI computing power skyrockets, the data center landscape is undergoing a significant transformation — shifting away from standalone server performance and toward system-level, rack-based upgrades. At the OCP Global Summit 2025, the industry spotlight moved beyond individual servers to full racks designed with 800V direct current (DC) power, liquid cooling, and high-bandwidth network integration.
Samsung Electronics is reportedly set to start production of its AI-powered home assistant robot, Ballie, at its facility in Ho Chi Minh City, Vietnam, suggesting that the long-delayed device is finally nearing mass production.
Compal Electronics Inc., one of Taiwan's leading contract manufacturers, has reportedly secured orders from Dell Technologies to produce AI servers beginning in 2026 — a milestone that underscores the company's growing foothold in the booming artificial intelligence hardware market.
Demand for AI servers remains robust, prompting industry players to actively develop and continuously update product architectures. Supply chain observers note that as AI endpoint requirements grow more complex, future server platforms will move away from one-size-fits-all standards toward customized configurations tailored to specific applications. This shift also increases market demand for rack designs with flexible, adaptable configurations, a key focus for server vendors going forward.
Quanta Senior Vice President Mike Yang stated that Quanta will continue expanding production capacity in the US and Thailand. Although Taiwan is no longer considering factory expansion, he expects 2025 to once again be an excellent year. Yang shared that Quanta aims to become a collaborator in intelligent production systems.
Teco and Foxconn are advancing their strategic partnership, focusing on AI data centers (AIDC), with plans to initiate concrete collaboration as early as 2026. Teco chairman Morris Li said in an interview on October 22, 2025, that both sides have established a dedicated project team communicating daily, steadily advancing the initiative.
AIC and AMD are launching the MI450 series Helios AI server cabinets in the second quarter of 2026, enhancing component placement and supported by partnerships with major tech firms.
Cybersecurity firm Check Point Software has released its September Cyber Security Report, showing that organizations worldwide faced an average of 1,900 cyberattacks per week, up 1% year-over-year. Taiwan once again ranked first in the Asia-Pacific region. The hardware and semiconductor industries were identified as primary targets.
As Nvidia's next-gen AI server platform enters mass production, cloud service providers (CSPs) continue advancing their in-house ASIC development plans, sustaining robust demand for AI data center infrastructure. The supply chain expects this momentum to further boost Taiwan's PCB manufacturing output growth in 2025.
Coupang announced on October 21 that it signed a letter of intent (LOI) with Taiwan's Ministry of Economic Affairs (MOEA) to jointly promote retail innovation and supply chain resilience in Taiwan. The LOI was signed at the MOEA's 2025 Taiwan Business Alliance Conference by Robert Porter, Coupang's Global Affairs Director, and Deputy Minister Cynthia Kiang.
South Korean AI chip startup Rebellions has announced a partnership with the Sarawak state government in Borneo, marking its official entry into the Association of Southeast Asian Nations (ASEAN) market. According to South Korea's News 1 and MTN, Rebellions signed a memorandum of understanding (MOU) with Sarawak's IC design company, SMD Semiconductor, to collaborate on AI chip design and development. The cooperation includes joint semiconductor development, the Sarawak state government's data center initiatives, and joint marketing activities.
As AI server deployment accelerates, Taiwan's four major motherboard manufacturers are experiencing notable shifts in growth momentum and product mix. Following ASRock's server motherboard and system subsidiary ASRock Rack preparing for a November 2025 IPO, Gigabyte's Giga Computing is set to follow suit by the end of 2025 at the earliest. These two subsidiaries have become key profit drivers for their parent companies.
In 2024, AI drove Taiwan's semiconductor output to surpass NT$5 trillion (approx. US$162.9 billion). It is expected to grow another 20% in 2025 to reach NT$6.3 trillion. Additionally, eighteen wafer fabs are scheduled to begin construction, with operations starting successively from 2026 to 2027. All eyes remain on TSMC's fabs. The Ministry of Economic Affairs (MOEA) estimates that by 2028, Taiwan's semiconductor output could reach NT$8 trillion.
US President Donald Trump is set to personally attend oral arguments on November 5, 2025, at the US Supreme Court regarding the legality of his administration's reciprocal tariffs—a rare move underscoring the critical importance of the case for his signature trade policies.
Anthropic PBC is in early talks with Alphabet Inc.'s Google on a potential cloud computing deal worth between US$1 billion and US$10 billion to secure additional AI computing power, according to Bloomberg and Ainvest.
ASRock Rack, a server-focused subsidiary of Pegatron, is preparing for its upcoming public listing and held a pre-IPO briefing on October 20, 2025. The event was attended by key figures including Pegatron chairman Tzu-Hsien Tong and ASRock chairman Hsu-Tien Tung, alongside senior representatives from major supply chain partners such as AMD, Intel, and Nvidia.
The Global Electronics Association (GEA) participated as a co-organizer in the 2025 International Microsystems, Packaging, Assembly, and Circuits Technology (IMPACT) Conference, hosting a special forum, "Component to System-Level Integration." The session brought together leading companies, including AMD, ASE Group, Kinsus, and Wistron, to discuss the development and standardization needs of advanced packaging technologies in the AI era.
Arm has extended its Flexible Access licensing program to include the latest Armv9 edge AI platform, enabling companies to access chip design tools at minimal cost and accelerate AI chip development and validation.
As Nvidia boldly announces the arrival of 800V high-voltage power supplies for AI servers, nearly all leading power semiconductor players have joined its supply chain. The industry is closely watching whether their technologies and solutions can meet the practical demands of future AI servers.
Eclat Forever Machinery (EFM), a Taiwan-based maker of advanced IC substrate equipment, told investors it expects stronger performance in 2026 than in 2025. Chairman Chou Cheng-chun said demand from major AI server chipmakers remains strong, driving Taiwan’s IC substrate leaders to commit billions of New Taiwan dollars to capacity expansion. Combined with EFM’s push to diversify its product portfolio, the company expects steady growth momentum ahead.
Pegatron Group's server subsidiary ASRock Rack is preparing to go public, marking a key milestone in the group's broader transformation. Pegatron Chairman T.H. Tung personally attended ASRock Rack's pre-IPO investor meeting on October 20 to show his support, joking that he came to embrace his "golden grandson." Tung also revealed that more subsidiaries are preparing for spin-offs following ASRock Rack's listing, signaling an active restructuring drive within the group.
ASRock Rack, the server motherboard and system development subsidiary of major motherboard manufacturer ASRock, is set to go public in November 2025. ASRock Rack chairman Lung-lun Hsu and president Wei-shi Sa have faced challenges including talent loss, restructuring, and operational downturns for more than a decade. In recent years, the company has finally capitalized on the artificial intelligence (AI) application boom, joining major supply chains and driving significant revenue growth, becoming a main source of growth for ASRock beyond PC motherboards and graphics cards.
SoftBank's plan to acquire ABB's robotics division for nearly US$5.4 billion by 2026 signals a significant shift in the global robotics landscape. The acquisition marks SoftBank's strategic move into the burgeoning physical AI sector, as Europe's traditional leadership in industrial robotics faces mounting challenges from Asia and the US.
Taiwan's industry players are seizing every opportunity in the rapidly advancing field of quantum technology. According to the National Science and Technology Council's (NSTC) quantum technology exhibit at the 2025 Future Tech Pavilion, a preliminary division of labor in the quantum computing industry has emerged, covering quantum chip design and fabrication to control modules and applications, with an increasing number of professors and students across Taiwan now taking part in related research projects.