Winbond Electronics is entering a powerful demand cycle, with tight supply conditions across DRAM, NOR flash, and SLC NAND extending beyond the near term and reshaping customer behaviour across the memory supply chain.
Cisco Systems forecast quarterly gross margins below market expectations, citing higher memory chip costs. The weaker margin outlook overshadowed stronger-than-expected results and sent shares down about 7% in extended trading.
SK Hynix is expected to begin shipments this month of its sixth-generation high-bandwidth memory, HBM4, a high-performance, low-power semiconductor designed for Nvidia's next-generation artificial intelligence accelerator, Vera Rubin.
China is preparing to initiate large-scale production of high-bandwidth memory (HBM), narrowing a technology gap with South Korea in a critical component for AI semiconductors. As Chinese manufacturers ramp up current-generation output, South Korean memory makers are moving to extend their market lead with next-generation products.
