Competition among major US cloud service providers (CSPs) and AI firms is intensifying, with Google currently perceived as holding a leading position in the overall AI market. Its advancements in AI foundational models, applications, cloud infrastructure, and especially its proprietary Tensor Processing Unit (TPU) chips distinguish it from competitors.

The 26th China International Optoelectronic Expo (CIOE) and the Shenzhen International Semiconductor & IC Exhibition (SEMI-e 2025) are being held at the Shenzhen International Convention and Exhibition Center.

Nvidia has introduced Rubin CPX, a next-generation GPU designed for massive-context AI, enabling systems to handle million-token software coding and generative video at unprecedented speed and efficiency. The GPU, part of the new Vera Rubin NVL144 CPX platform, is expected to be available by the end of 2026.

NXP Semiconductors has appointed Sandy Hu, a 25-year semiconductor veteran and former TI China president, as senior vice president of sales and marketing for Greater China. She will report to Robert Li, NXP's executive vice president and head of China operations.

To break through the technical, mass production, and yield challenges in advanced packaging processes such as 3D IC and CoWoS, SEMI, together with TSMC and ASE Holdings, has established the "3DIC Advanced Manufacturing Alliance." The alliance gathers industry players from the equipment and materials sectors to build a globally competitive local supply chain, ensuring that backend processes no longer become growth bottlenecks for the artificial intelligence (AI) industry.

Czech Minister for Science, Research and Innovation Marek Ženíšek recently visited Taiwan to meet with National Science and Technology Council (NSTC) minister Cheng-wen Wu. In addition to in-depth discussions on their complementary strengths in laser technology, Wu also highlighted Taiwan's government initiatives in space and defense-related industries, with the hope of expanding collaboration with other countries.

Malaysia's IC design firm Oppstar has entered into two MoUs with Inventec to collaborate on next-generation AI chips and form a joint venture (JV), according to documents filed with Bursa Malaysia.

The government has long provided research and development subsidies to share the risks of innovation among manufacturers, a key strategy driving Taiwan's industry. As many as 53 companies have submitted applications for subsidies under a new government program designed to advance Taiwan's IC design sector.

India-based IC design firm L&T Semiconductor Technologies (LTSCT) announced on Friday that it has acquired the power module design assets of Japan's Fujitsu General Electronics (FGEL), marking a significant step in its push to expand capabilities in power electronics.

Intel has announced a series of senior leadership appointments aimed at advancing its core product business, scaling its foundry operations, and reinforcing engineering capabilities across the company. The moves, which include new hires and expanded responsibilities for key executives, come as Intel continues its efforts to improve execution and sharpen competitiveness in the semiconductor industry.

Apple's much-anticipated annual event is scheduled for September 10 at 1 a.m. Taiwan time, where several new products, including the iPhone series, Apple Watch, and AirPods Pro, are expected to be introduced. The upcoming iPhone lineup is expected to showcase significant design and system architecture changes for 2025, while other devices are likely to feature processor upgrades and enhanced functionalities.

Samsung Electronics is reportedly expected to feature its in-house application processor (AP), the Exynos 2600, in the upcoming Galaxy S26 flagship series scheduled for early 2026. This move marks Exynos's return to Samsung's main flagship market, a bet on both corporate pride and technological prowess.

Broadcom delivered strong earnings guidance with its latest results, as CEO Hock Tan revealed a US$10 billion ASIC mass-production order from a major new customer outside the core hyperscale cloud service provider segment.

SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies across 4,100 booths. The event is projected to attract more than 100,000 visitors, setting a new record in scale.

Rebellions, a rising South Korean AI chipmaker, has become a focal point in the rivalry between Samsung Electronics and SK Hynix as the two giants compete for leadership in next-generation semiconductors, putting the startup's strategy under intense scrutiny.

Global chipmakers are signaling shifts in pricing strategies, with more vendors considering hikes. Industry sources say China, long a market of cutthroat competition, is becoming the key battleground. The move reflects not only market dynamics but also a strategic recalibration under intensifying geopolitical pressures.

Shenzhen International Semiconductor & IC Exhibition, known as SEMI-e 2025, will take place September 10-12 at the Shenzhen World Exhibition & Convention Center. The event is expected to draw thousands of chipmakers, equipment suppliers, and technology companies as the semiconductor industry continues to expand globally.

South Korean startup Rebellions has unveiled a new AI accelerator at the Hot Chips 2025 symposium in California, positioning itself as a rising challenger in the hyperscale computing market.

Broadcom CEO Hock Tan revealed the company has landed a US$10 billion order from a mystery customer, which insiders now identify as OpenAI. The two firms are developing OpenAI's first custom artificial intelligence (AI) processor, scheduled to enter mass production in 2026.

On September 3, 2025, Anhui Anfu Battery Technology announced its portfolio company Xiangdi Xian Computing Technology (XDXCT) had completed tape-out validation of its next-generation "Fuxi" GPU architecture. The chip demonstrated strong graphics rendering and parallel computing performance, with early optimizations confirming it can run the much-anticipated title Black Myth: Wukong.

Broadcom posted record earnings for the third quarter of fiscal 2025, topping Wall Street forecasts on revenue and profit, and disclosed a custom AI chip order exceeding US$10 billion from an undisclosed client. The deal is expected to materially lift its AI outlook in fiscal 2026, alleviating investor concerns over a potential slowdown.

Ant Group is ramping up investments in China's semiconductor industry, targeting several domestic chip startups. After securing dominance in payments and fintech, the company is shifting into computing hardware, betting on design-focused firms that align with Beijing's push for technology self-reliance. Analysts see the move as both a nod to China's AI localization campaign and a bid to find new growth engines after Ant's aborted IPO.

Google has reportedly been in talks with smaller CSPs to deploy its proprietary TPU chips alongside Nvidia Corporation's GPUs in data centers. This approach aims to reduce reliance on expensive Nvidia GPUs and accelerate scaling of Google's internal AI infrastructure.

China's drive to localize artificial intelligence chips briefly sparked speculation that Cambricon Technologies would gain ground and that Alibaba might join the race with its own processors. Those rumors, however, quickly lost momentum.

MediaTek's much-anticipated AI PC chip with Nvidia has yet to launch, but the Taiwanese firm is making headway in Chromebooks. Industry insiders argue that if Chromebooks were treated as mainstream PCs, MediaTek's processors would already meet the bar for AI PC chips.