North America fab tool book-to-bill slips in April 2012, says SEMI

7h 28min ago

North America-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 1.10 in April 2012, down from 1.12 in March, according to SEMI.

Global wafer shipments grow 1% in 1Q12, says SEMI

May 10, 10:45

Overall area of silicon wafers shipped in the first quarter of 2012 increased 1% on quarter, but decreased 11% from a year ago, according to SEMI in its quarterly analysis of the...

SEMI book-to-bill rises for sixth straight month

Apr 23, 16:10

The three-month average book-to-bill ratio for North America-based manufacturers of semiconductor equipment rose to 1.13 in March 2012, up for the sixth consecutive month, according...

Smartphone PAs to buoy Win Semi 2Q12 sales

Apr 18, 14:17

GaAs IC foundry Win Semiconductors is expected to report impressive results for the second quarter of 2012, thanks to strong demand for its HBT fabrication service from power amplifier...

Win Semi, VPEC to benefit from new iPad

Apr 2, 12:00

A teardown analysis performed by Chipworks has revealed that Avago supplies three power amplifiers – one WCDMA PA and two 4G LTE ones – for Apple's new iPad. Avago's main...

Taiwan industries going green

Mar 29, 12:02

Semiconductor Equipment and Materials International (SEMI) Taiwan conducted a forum discussing the experience and challenges of the green energy industry on March 27, 2012. Taiwan-based...

Fab equipment spending poised to hit record in 2013, says SEMI

Mar 12, 16:06

Semiconductor fab equipment spending will remain flat at US$38.85 billion in 2012, but climb to a record US$45.5 billion in 2013, according to estimates made by SEMI.

North America fab tool book-to-bill up in January 2012, says SEMI

Feb 24, 12:31

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.95 for January 2012, up from 0.85 in the prior month and scoring the highest since May...

Rambus buys Unity Semi for US$35 million

Feb 7, 15:46

Rambus has acquired privately-held Unity Semiconductor, which develops NAND flash successor technologies, for US$35 million in cash, according to the technology licensing company.

SEMI book-to-bill ratio grows three months in a row

Jan 30, 10:25

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.88 for December 2011, up for the third consecutive month, according to SEMI. A book-to-bill...

Lite-On Semi to step into MOSFET production

Jan 18, 13:44

Lite-On Semiconductor will start to ship its in-house produced MOSFETs in the second quarter of 2012, according to the company, adding that the new product line is expected to help...

Low demand will likely continue in 1Q12, says Lite-On Semiconductor executive

Jan 12, 01:20

Eric Kuo, general manager of Taiwan-based Lite-On Semiconductor has expressed a conservative view for first-quarter 2012. Kuo noted that inventory levels in the semiconductor market...

Chip fab spending set to decline in 2012, says SEMI

Jan 11, 15:47

Semiconductor fab equipment spending is expected to decline by approximately 11% in 2012, according to SEMI's preliminary forecast. Spending is projected to drop in the first half...

North America November chip-gear orders up 5%, says SEMI

Dec 16, 14:38

North America-based manufacturers of semiconductor equipment posted US$973.3 million in orders in November 2011 (three-month average basis), up 5% from the revised level of US$926.8...

IC packaging materials market to reach US$25.7 billion by 2015, says SEMI

Dec 16, 13:58

The market for semiconductor packaging materials, including thermal interface materials, is expected to reach US$22.8 billion in 2011 and grow to US$25.7 billion by 2015, according...

Lite-On Semi reports decline in November revenues

Dec 7, 14:27

Lite-On Semiconductor has announced that consolidated revenues for November 2011 amounted to NT$636 million (US$21.1 million), down 16.1% on year and down 4.3% on month. The firm...

Win Semi set for OTC listing, says report

Newswatch - Nov 24, 17:01

GaAs IC foundry Win Semiconductors is scheduled to be listed on Taiwan's over-the-counter (OTC) market on December 13 at NT$32 (US$1.05) per share, according to a Chinese-language...

North America October chip-gear orders up 1%, says SEMI

Nov 18, 14:51

North America-based manufacturers of semiconductor equipment posted US$939.4 million in orders in October 2011 (on a three-month average basis), up 1.4% from the revised September...

Win Semi sets sales record for sixth straight month

Newswatch - Nov 4, 15:15

Win Semiconductors, a major GaAs IC foundry, enjoyed another month of record sales in October thanks to continued-strong shipments of products used in smartphones.

SEMI book-to-bill falls again in September

Oct 21, 15:12

North America-based semiconductor equipment makers reported a book-to-bill ratio of 0.75 in September 2011, declining for the fifth month in a row.

Silicon wafer shipments to post single-digit growth in 2012 and 2013, says SEMI

Oct 13, 10:41

Silicon wafer shipments to the global semiconductor industry are expected to see flat growth in 2011, following 2010 when shipments rebounded 39% to 9.12 billion square inches, according...

PV equipment book-to-bill ratio drops below parity in 2Q11, says SEMI

Sep 22, 15:55

SEMI has reported that worldwide photovoltaic manufacturing equipment billings reached US$2.03 billion for the quarter ended on June 30, 2011. Billings increased 17% sequentially,...

SEMI book-to-bill ratio slips to 0.80 in August

Sep 16, 16:06

North American-based manufacturers of semiconductor equipment posted a book-to-bill ratio of 0.80 for August 2011, down from 0.85 in July, according to new figures from SEMI. A book-to-bill...

450mm and EUV linked with uncertainty, says SEMI

Sep 9, 11:14

The transition to manufacturing semiconductors on larger wafers continues to be one of the hottest topics in the industry. However, uncertainty with EUV rollout has exacerbated the...

Proportion of copper wire bonding to rise to over 20% in 2011, says SEMI

Sep 7, 16:36

Due to rising gold prices, replacement of conventional processes based on gold wire with copper-wire bonding processes is increasing. The proportion of total wire bonding volume for...

SEMICON Taiwan 2011: Major IDMs participate for procurement talks

Sep 7, 15:36

Major IDMs including Panasonic Semiconductor, Philips, Renesas Electronics and Toshiba are being invited to hold face-to-face procurement talks with Taiwan-based suppliers of chemicals,...

Chip equipment billings up 31% in 2Q11, says SEMI

Sep 7, 14:47

Worldwide semiconductor manufacturing equipment billings reached US$11.92 billion in the second quarter of 2011, according to SEMI. The billings figure is 1% lower than that in the...

SEMI downgrades forecast for 2011 fab-tool spending, but still sees record year

Sep 7, 10:47

SEMI's latest statistics suggests that capital expenditure will increase to US$41.1 billion in 2011, the highest on record, according to the industry association. The prediction is...

Chip equipment book-to-bill lower in July 2011

Aug 19, 10:30

North America-based semiconductor production equipment makers posted a book-to-bill ratio of 0.86 in July, down from 0.94 in June, according to SEMI. Meanwhile, data gathered by the...

Silicon wafer shipments up 5% in 2Q11, says SEMI

Aug 4, 16:49

Worldwide silicon wafer area shipments increased 5% during the second quarter of 2011 compared to the prior quarter, according to SEMI.

North America chip-gear orders slip in June, says SEMI

Jul 21, 01:00

North America-based manufacturers of semiconductor equipment posted US$1.55 billion in orders in June 2011 (three-month average basis), down 4.4% from the revised level of US$1.62...

Chip equipment sales to grow 12% in 2011, says SEMI

Jul 12, 13:56

Worldwide sales of semiconductor manufacturing equipment will reach US$44.33 billion in 2011, representing growth of 12.1% on year, according to SEMI's mid-year forecast.