TSMC and Samsung Foundry, which share orders for Apple's A9 application processors, have both started volume production of the chips, according to industry sources.
Just before production kicked off, Apple requested modifications to the mask patterns prompting both contract chipmakers to rework wafers, said the sources. Nevertheless, the event should not interrupt the new iPhone launch schedule, the sources noted.
TSMC, with its 16nm FinFET process technology, will enter mass production of the A9 chips starting the fourth quarter of 2015, the sources indicated.
TSMC will also manufacture fingerprint sensors and audio chips on a contract basis for the upcoming iPhone devices at its 12-inch fabs, the sources observed.
Previous reports suggested TSMC would use its 65nm fabrication process to supply fingerprint sensors for the next-generation iPhones expected in the fall of 2015. In addition, the foundry will reportedly manufacture iPhone chips for Cirrus Logic using 45/55nm process technologies.
TSMC has responded saying the company does not talk about customer engagements.
An estimated 80 million units of Apple's new iPhones will be shipped by the end of 2015, the sources said.
Article translated by Jessie Shen
