IT + CE
Cooling module makers to further reduce mobile device heat pipe thickness; expect penetration rate of over 15%
Aaron Lee, Taipei; Joseph Tsai, DIGITIMES

Cooling module makers such as Japan-based Furukawa Electric Group and Fujikura and Taiwan-based Chaun-Choung Technology and Taisol Electronics, are looking to reduce the thickness of their existing 0.6mm heat pipes for smart mobile devices by 25% and...

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