Bits + chips
IC substrate makers to ramp up FC CSP substrates in 2014
Patty Wang, Taipei; Steve Shen, DIGITIMES

IC substrate makers Kinsus Interconnect Technology, Unimicron Technology and Nanya PCB all plan to ramp up their production capacity for flip-chip chip scale package (FC CSP) substrates in 2014 to cope with demand from IC backend service firms, according...

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