Bits + chips
UMC to break ground for new factories at Fab 12A
Josephine Lien, Taipei; Jessie Shen, DIGITIMES

United Microelectronics (UMC) will soon break ground for the fifth and sixth phase construction of its 12-inch fab located at the Southern Taiwan Science Park (STSP), according to an invitation to the groundbreaking ceremony scheduled for May 24.

The article you are trying to open requires News database subscription. Please sign in if you wish to continue.
© 2019 DIGITIMES Inc. All rights reserved.
Please do not republish, publicly broadcast or publicly transmit content from this website without written permission from DIGITIMES Inc. Please contact us if you have any questions.