Taipei, Thursday, May 23, 2013 04:09 (GMT+8)
mostly cloudy
Taipei
25°C
Toshiba announces 24nm, ECC-integrated NAND chip
Press release; Jessie Shen, DIGITIMES [Wednesday 6 April 2011]

Toshiba has announced that it has enhanced its NAND flash portfolio with the introduction of 24nm generation "SmartNAND," which integrates error management into the NAND package. The new chips will support simplified host-side design and application of advanced NAND process generation in digital audio players, tablet PCs, information equipment, digital TVs, set-top boxes (STBs) and other consumer applications that require high-density, non-volatile memory.

Toshiba's new embedded NAND series is built using its 24nm process technology, and integrates a control chip supporting error correction code (ECC). Available in four to 64 gigabyte (GB) capacities, the devices are designed to remove the burden of ECC from the host processor while minimizing protocol changes. The SmartNAND portfolio is targeted for portable media players, tablet PCs and other consumer digital products.

The new 24nm product lineup will replace current 32nm generation devices, Toshiba said, adding that the advanced process combined with faster controller and internal interface will realize faster read and write speeds and enhance overall performance. SmartNAND also supports a range of read and write speeds, optimized to suit design objectives, and four read modes and two write modes will be offered.

Samples of the new SmartNAND lineup will be available from middle of April, and mass production will start in the second quarter of CY2011, according to Toshiba.

Toshiba: 24nm generation SmartNAND portfolio

Part number

Capacity

Package

Start of samples

Start of mass production

THGVR1G5D1HTA00

4GB

48 pin TSOP

May

2Q11

THGVR1G5D1HLA09

52 land LGA

Aug

3Q11

THGVR1G6D1GTA00

8GB

48 pin TSOP

Apr

2Q11

THGVR1G6D1GLA09

52 land LGA

Jul

3Q11

THGVR1G7D2GTA00

16GB

48 pin TSOP

Sep

4Q11

THGVR1G7D2GLA09

52 land LGA

May

2Q11

THGVR1G8D4GLA09

32GB

52 land LGA

Jun

3Q11

THGVR1G9D8GLA09

64GB

52 land LGA

Aug

3Q11

Source: Company, compiled by Digitimes, April 2011

Toshiba SmartNAND

Toshiba SmartNAND
Photo: Company

Realtime news
  • Taiwan market: LG launches waterproof smartphone

    Mobile + telecom | 5h 56min ago

  • Hermes to see revenues grow higher than 10% sequentially in 2Q13

    Bits + chips | 6h 8min ago

  • Foxconn able to produce carbon nanotube touch panel sizes up to 10-inch

    Displays | 6h 23min ago

  • Buynow expects EPS of at least NT$4.50 for 2013

    IT + CE | 6h 25min ago

  • Elan shipping touchscreen controller ICs for new Nexus 7

    Bits + chips | 6h 27min ago

  • Samsung showcases new displays at SID 2013

    Displays | 7h 9min ago

  • E Ink unveils low temperature matrix electronic paper display for freezers

    Displays | 7h 20min ago

  • UMC Singapore unit expands and puts focus on R&D

    Bits + chips | 7h 26min ago

  • E Ink launches 3 pigment electronic paper display

    Displays | 7h 28min ago

  • HannStar to reach 95% utilization in 2Q13

    Displays | 7h 30min ago

  • Windows 8 expected to take up 5-8% of global tablet shipments in 2013, say Taiwan makers

    IT + CE | 7h 33min ago

  • Supplies of NAND flash to be tight in July-August, says Phison

    Before Going to Press | 7h 53min ago

  • TPK to see orders bump up in 3Q13

    Before Going to Press | 8h 6min ago

  • Wintek expects to see positive turnaround in July 2013, says chairman

    Before Going to Press | 8h 10min ago

Pause
 | 
View more

22-May-2013 markets closed

 LastChange

TAIEX (TSE)8398.84+15.79+0.19% 

TSE electronic317.55+0.70+0.22% 

GTSM (OTC)120.71+0.33+0.27% 

OTC electronic145.64+1.03+0.71% 

Development and commercialization of Thunderbolt technology
Trends and forecast for 2013 touch panel market
Trends in China LED chip and packaging sector
  • Samsung reportedly to outsource more chips

    Samsung Electronics reportedly is looking to expand the purchase of memory products, including mobile DRAM chips and eMMC NAND devices, from outside.

  • Micron reaches deal to acquire Elpida

    Micron Technology and Elpida Memory's trustees have reached an agreement for Micron to acquire Elpida. Micron also announced a separate agreement with...

  • Taiwan DRAM firms mull fab sales

    Taiwan-based DRAM chipmakers including Powerchip Technology and ProMOS Technologies are considering selling fabs in order to preserve cash and strengthen...

  • Samsung foundry biz expanding

    Specializing in the manufacture of memory chips and LCD panels, Samsung's component operations are undergoing a focus shift to advanced process design...

  • 2H 2012 global TFT panel market forecast

    Digitimes Research predicts there will be a total of 389 million large-sized TFT LCD panels shipped in 2H12, with 195 million in the third quarter and 194 million in the fourth quarter - with the total representing a 7.6% increase over the first half of this year.

  • Trends in the China video market

    In addition to strong potential video content demand in China, the market has developed rapidly due to government intervention and delays in establishing copyright protections.

  • Trends in Asia LED chip manufacturing industry

    Asia is playing an ever more important role in upstream LED chip manufacturing. The region accounted for 80% of MOCVD demand in 2011 and will account for 90% in 2012, largely because Taiwan, Japan, South Korea and China are the major global centers for LED chip production.