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AMD to integrate USB 3.0 support in upcoming chipsets; to launch more CPUs in 2H10
Monica Chen, Taipei; Joseph Tsai, DIGITIMES
AMD is currently in talks with Renesas Electronics, which was merged with Japan-based NEC, about the licensing of USB 3.0 technology, and is considering integrating USB 3.0 support in its upcoming Hudson D1 southbridge chipsets, according to sources...
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Amid bleak outlook for downstream vendors, uncertainties surrounding the US-China trade tension, factory relocation and exchange rate volatility, global smartphone AP shipments may experience further decline in 2019, down two years in row, according to Digitimes Research estimates.
According to Digitimes Research, Taiwan-based server vendors, including suppliers of motherboards, end systems, storage devices and related network equipment, continue to enjoy growth in 2018. In terms of volume, global server shipments will show continuing growth throughout 2018 and 2019.
This Digitimes Research Special Report offers global shipment forecasts for three major mobile device market segments - smartphones, notebooks and tablets - for the year 2019 and beyond. It gives in-depth analyses of their respective market outlooks, with shipment forecasts extending to 2023.