Bits + chips
Elpida, PTI and UMC enter joint development deal for 3D-TSV technology
Ingrid Lee and Josephine Lien, Taipei; Jessie Shen, DIGITIMES

Elpida Memory, Powertech Technology (PTI) and United Microelectronics Corporation (UMC) have jointly announced their entry into a 3-way cooperation to advance 3D IC integration technologies for advanced processes including 28nm. This collaboration will...

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