Taipei, Monday, September 25, 2017 18:03 (GMT+8)
mostly cloudy
Taipei
33°C
Asustek launches workstation motherboard with dual CPUs
Press release, March 4; Joseph Tsai, DIGITIMES [Tuesday 4 March 2008]

Asustek has released the Z7S WS workstation motherboard, equipped with dual 771 sockets. The board utilizes the latest Intel 5400 chipset and also supports fully buffered DDR2 800MHz dual-channel memory, dual PCI Express 2.0 x16 slots; and comes in the compact CEB form factor.

The Z7S's particular heat-pipe design is made to increase durability, life spans and enhance thermal capacity. It also provides highly efficient operation with less heat than traditional heat sink designs, according to the company.

The optional Asustek Patented MemCool Kit maximizes FB-DIMM performance by eliminating the potential risk of system memory throttling from over-temperature; as well as minimizing effort for SIs targeting thermal and acoustic solutions, pointed out the company

Asustek Z7S WS workstation motherboard specifications

Item

Detail

Processor

Supports two Socket LGA771 dual-core Intel Xeon 5100/5200

or quad-core Intel Xeon 5300/5400 processor with FSB up to 1600MHz

Chipset

Intel 5400 Memory Controller Hub (MCH)
Intel ESB2E I/O Controller Hub (ICH)

Form Factor

CEB form factor

Memory

6 slots (4-channel) DDR2 800/667/533 memory support up to 24GB

Source: Company, compiled by Digitimes, March 2008

Asustek Z7S WS workstation motherboard

Asustek Z7S WS workstation motherboard
Photo: Company

Global notebook shipment forecast, 2017 and beyond
China AMOLED panel capacity expansion forecast, 2016-2020
Global notebook shipment forecast, 2017 and beyond
  • China AMOLED panel capacity expansion forecast, 2016-2020

    This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

  • Global AP demand forecast, 2017-2020

    Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.

  • Global notebook shipment forecast, 2017 and beyond

    This Digitimes Special Report examines key factors in the notebook industry, including products, vendors and ODMs, that will affect total shipments in 2017 and through 2021.