A Hynix Semiconductor PR spokesperson has refuted claims made in a recent report that Apple has turned to Samsung Electronics to fill NAND flash orders originally placed with Hynix, due to Hynix running into production issues with its 60nm multi-level cell (MLC) process.
While Hynix does admit it had an earlier problem with a certain quantity from a batch of 60nm-made MLC, the spokesperson indicated that the issues have been completely resolved and the Korean memory maker currently has no problems providing products to Apple. The spokesperson added that Hynix confirms that Apply has never shifted orders from Hynix to Samsung.
During Hynix’s most recent investors conference the company stated its total wafer capacity at the end of the second quarter was 940,000 200mm equivalents, of which 28% was allocated to NAND. The company said that proportion should grow to 35% in the third quarter, even as total wafer capacity will remain flat.
Hynix’s 60nm production proportion was more than 60% of its total at the end of 2Q07 but will grow to 90% by the end of the third quarter. Hynix will also start producing 57nm-based NAND flash this quarter and 48nm production will begin in the fourth quarter.
Hynix is also continuing its migration to MLC, with the related proportion surpassing the 90% level this quarter, up from 66% in the second quarter. Most of the MLC is 8Gb parts, and Hynix will cut back on its 4Gb MLC/SLC production. However, the company expects its ASP (average selling price) decline to be much higher than the industry average this quarter, as 8Gb MLC prices are not sold at a premium compared to 4Gb MLC/SLC parts.
Article edited by Michael McManus
