Xiaomi has unveiled its first large language model (LLM) focused on reasoning tasks—MiMo-7B—which has outperformed significantly larger models from global tech giants. Despite its relatively compact 7-billion-parameter design, MiMo-7B surpassed OpenAI's closed-source o1-mini and Alibaba's 32B-parameter open-source Qwen-32B-Preview in math reasoning (AIME 24–25) and code generation (LiveCodeBench v5) benchmarks.
After becoming Taiwan's first unicorn to go public in the US, Gogoro—the electric scooter company known for its sleek design and battery-swapping model—has struggled to maintain investor confidence. The company recently filed to transfer its listing from the Nasdaq Global Select Market to the Nasdaq Capital Market, a move typically seen as a step-down. Though 2025 may have started with a stumble, some in the company's supply chain say the year could yet hold promise.
As the automotive industry accelerates toward a software-defined future, LG Electronics and MediaTek have jointly revealed a new generation of in-vehicle infotainment (IVI) solutions, aiming to redefine the digital cockpit experience.
As the demand for advanced packaging technologies like CoWoS (Chip-on-Wafer-on-Substrate) continues to outpace supply, the semiconductor packaging equipment supply chain is increasingly optimistic about the potential of Panel Level Packaging (PLP) to take the baton. With its inherent advantages, such as transforming substrates from round to square, PLP is positioned to become the new mainstream technology for AI chip packaging.
