Applied Materials announced that it has made a significant leap forward in deep trench etch nanomanufacturing technology with its new Applied Centura Mariana Trench etch system. Mariana is the first system that can etch 80:1 aspect ratio trenches – a critical capability that will allow customers to scale DRAM capacitors beyond 70nm, the equipment maker highlighted.
Dual-frequency tuning capabilities tightly control the etch profile and critical dimension (CD) with 2% etch depth non-uniformity, while the system's plasma chemistry achieves unprecedented mask selectivity, Applied stressed. "Working with our customer, we've developed the industry's most advanced deep trench technology with the capability of etching structures with 30% higher aspect ratios than currently available systems." said Tom St. Dennis, senior vice president and general manager of Applied Materials' Etch, Cleans, Front End and Implant Groups. Dennis also noted that Applied has already landed orders for use of this Marana for 70nm DRAM production.
The Applied Centura Mariana Trench Etch can etch 80:1 aspect ratio trenches, allowing chipmakers to scale DRAM capacitors beyond 70nm
Photo: Company
Article translated by Esther Lam and edited by Ricky Morris
