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Semiconductor BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC
Server & HPC Global server market, 2Q 2026: Supply constraints curb shipment momentum, global server shipments up 2.8% in 3Q26
More Topics Winning the AI glasses race: Why myopia users and optical retailers hold key to mass adoption
Personal Computing Taiwan notebook industry, 2Q 2026
Physical AI Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration
Winning the AI glasses race: Why myopia users and optical retailers hold key to mass adoption
AI glasses are emerging as a key gateway to AI; the market is projected to grow rapidly between 2026 and 2030, with a compound annual growth rate of 48%, creating new opportunities across the supply chain.
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Siri AI taps Google Gemini LLM technology, with future development focused on deep third-party app integration
DIGITIMES has observed that Siri AI is built around four core layers - devices, models, reasoning and applications - and is designed to transform Siri from a voice assistant into an AI agent capable of executing tasks
Global server market, 2Q 2026: Supply constraints curb shipment momentum, global server shipments up 2.8% in 3Q26
In the second quarter of 2026, global server shipments were below prior expectations, growing 3.8% quarter-over-quarter. The main reason was tight supply of key components such as memory, CPU, and IC substrate, which curbed overall system shipment momentum.
BYD leverages in-house semiconductors to power next phase of automotive intelligence; smart driving chip roadmap moves towards 4nm SoC
DIGITIMES notes that BYD Semiconductor's portfolio has expanded from the IGBTs and SiC power chips developed to meet early electric vehicle (EV) demand into high-computing-power smart-driving SoCs.
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
AI infrastructure enters multi-architecture fabric competition; Optical-copper interconnects and supply-chain coordination determine system performance
Taiwan notebook industry, 2Q 2026
Taiwan notebook industry, 2Q 2026
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