Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at SEMICON Taiwan 2026 that the company's new Dresden fab is ramping at twice the pace of prior expansions, boosted by AI tools and a single virtual fab strategy. He said the facility could reach full capacity in two to three years as demand from the market and from AI takes off.

Infineon COO Alexander Gorski told DIGITIMES in an exclusive interview at Semicon Taiwan 2026 that the current global chip shortage is unlike the one during Covid-19 and will take longer to resolve. He also discussed progress on Infineon's new Dresden plant, in-house manufacturing, outsourcing, and the company's global footprint.

"Demo is not a product," Jingwei Hirain president Chengjian Fan told DIGITIMES in an interview, arguing that China's new-energy vehicle industry has learned hard lessons as fast-moving startups, deep in-house development, and tougher supplier scrutiny reshape the market. He said software demand has increased more than tenfold compared with the internal combustion engine era, while the fastest mass-production delivery cycle in China has been as short as 12 months.

Excitement is growing among investors and the public over the rising capabilities of humanoid robots. Yet as robot makers seek to turn their lab-built innovations into real-world commercial tools, one key bottleneck has emerged: safety.

As global net-zero efforts intensify, governments and major technology companies are investing in emerging nuclear technologies to meet the huge electricity demand from AI data centers and the semiconductor industry. Because nuclear power offers zero-carbon emissions, small modular reactors (SMRs) are drawing growing attention as a potential new power solution in the AI era.

Price wars. Capacity races. Years of losses steep enough to earn a lasting nickname.

The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely lasting through 2028 and possibly into 2030. He said supply is tightening further as AI and edge computing create rigid demand, pushing the supply chain to focus on higher-value applications.

Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according to Cadence Design Systems. This is narrowing a gap that once separated semiconductor development from facility engineering.

Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers design and procure computing capacity.

Autonomous driving technology is maturing, and a future in which cars entirely drive themselves is quickly approaching in the rearview mirror. Yet safety and trust remain crucial barriers to overcome before fully autonomous driving becomes a reality, and a key part of this is the "eyes" of the car.

As AI chips continue to grow in size, the shift in advanced packaging from 300 mm wafers to square panels is becoming clearer, driving parallel development of new packaging technologies including FOPLP, CoPoS, and Glass Core. Manz Asia general manager Robert Lin said yield will determine whether Glass Core can move into mass production.

As physical AI and robotics draw unprecedented market attention, a key bottleneck is clogging the deployment pipeline: quality, real-world physical data. To move applications from the lab to real-world deployment, companies are getting creative in overcoming this obstacle while balancing affordability, stability, and data volumes.

Ken Phua, former Arm China co-CEO, spent 25 years abroad building someone else's business model. He came home to Singapore to build his own.

Amid escalating geopolitical tensions, defense awareness is rising rapidly worldwide, with drone and counter-drone technologies becoming key areas of development for governments and defense industries. Taiwan is also continuing to upgrade technologies for radar detection, missile defense, and other military systems.

Global AI computing is rapidly moving beyond single-GPU systems toward AI Factory architectures, where agentic AI and inference workloads are pushing data centers to rely on networking, optics, packaging, cooling, power delivery and software co-design rather than raw accelerator counts. In a DIGITIMES interview, Nvidia Senior Vice President of Networking Gilad Shainer said the real unit of computing is now the entire data center, not an individual server.