Frankly speaking

DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges that need to be addressed in an industry that is marked by constant change. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call, especially for companies that are targeting the Greater China market.

The text is available free of charge for three days after publish date; older interviews require membership.

Please contact us if you're interested in arranging an interview.

Displaying interviews tagged IC manufacturing [back to index]

Fair business environment necessary: Q&A with Tessera COO Mike Bereziuk

Wednesday 23 April 2008

MEMS microphone is a business of dedication and diversification: Q&A with Akustica sales VP Michael E Elchik

Thursday 3 April 2008

Pursuit of market share and sales growth to be consistent: Q&A with Freescale sales and marketing senior VP Henri Richard

Friday 28 March 2008

Handset demand growth in China promising: Q&A with NXP Greater China VP Stephen Lin

Thursday 27 March 2008

MEMS market growth to beat expectations: Q&A with TSMC mainstream technology business development director George Liu

Friday 21 March 2008

China domestic demand still strong: Q&A with NXP regional executive for Greater China, Mike Yeh

Wednesday 12 March 2008

Enhanced user experience at core of handset solution: Q&A with TI senior VP of wireless terminals business unit, Greg Delagi

Tuesday 26 February 2008

Providing a start-up platform for equipment localization: Q&A with Applied Materials

Tuesday 15 January 2008

Persistent technology advancement to enable growth to beat industry average: Q&A with KLA-Tencor Taiwan GM

Thursday 10 January 2008

Eyeing the China market: Q&A with David Sheu, chairman of equipment supplier Spirox

Wednesday 12 December 2007

Gearing up for PV industry: Q&A with Applied Materials SVP Mark Pinto

Wednesday 5 December 2007

Treating every customer like Intel: Q&A with Tower CEO Russell Ellwanger

Friday 23 November 2007

No conflict in handset chip market share and profitability: Q&A with STMicroelectronics COO Alain Dutheil

Thursday 15 November 2007

ASML reiterates direction on EUV: Q&A with KW Cheng, strategic sales and marketing VP of Asia Pacific

Monday 1 October 2007

Customer is the key for success: Q&A with TI Asia operation president Larry Tan

Monday 1 October 2007

Looking beyond driver IC packaging and testing: Q&A with IST president Gray Huang

Friday 14 September 2007

Getting to know Terry Tsao: Q&A with the new SEMI Southeast Asia president

Thursday 13 September 2007

Bonding with SUSS MicroTec: Q&A with Heinz Siegert, general manager of SUSS Taiwan

Thursday 13 September 2007

The state of the industry: Q&A with SEMI president Stanley Myers

Wednesday 12 September 2007

Second 12-inch fab and 32nm migration in the works: Q&A with Chartered CTO Simon Yang

Thursday 6 September 2007

Transitioning from a "wafer-printing fab": Q&A with Silterra CEO Eg Kah Yee, part II

Thursday 30 August 2007

Added value key for R&D development: Q&A with Ulf Schneider, Infineon Asia Pacific Singapore development center VP

Tuesday 28 August 2007

The niche and big niche for SSD: Q&A with Dean A Klein, Micron memory system development VP, part II

Friday 24 August 2007
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