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AUO unit plans to ride synergy gains momentum into entering TSMC ecosystem

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AI buildout lifts demand for China high-speed optical module makers

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SJSemi expands 2.5D packaging to 3.3-reticle size for AI and HPC chips

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Intel looks to attract leading notebook vendors for CBB initiative

Celia Lin, Taipei

Oct 17, 2006, 21:47 0

Next year, the notebook market may see products based on Intel's Common Building Block (CBB) initiative introduced by leading brands, according to sources...

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World Diamond Technology accelerates mass production of 300 mm diamond wafers

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