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| Frankly speaking |
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DIGITIMES regularly interviews leading industry executives, inviting them to talk frankly about the technology issues and the business challenges of our rapidly changing industry. We always welcome the opportunity to discuss industry trends and issues face-to-face, via email or during a conference call. The text is available free of charge for three days after publish date; older interviews require membership. Please contact us if you're interested in arranging an interview. |
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20 Nov 2009: | Strong partnerships and complete solutions drive growth: Q&A with LSI executive VP and general manager Jeff Richardson |
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30 Sep 2009: | A peek at the semiconductor industry from the materials side: Q&A with Wouter Taen, BASF director of business management, Asia |
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25 Sep 2009: | Taiwan renewable energy feed-in tariffs not final: Q&A with Huey-ching Yeh, director general of the Bureau of Energy |
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8 Sep 2009: | Bosch-Akustica acquisition a win-win strategy: Q&A with Akustica founder Michael E Elchik |
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30 Jun 2009: | Chipbond gearing up 12-inch wafer bumping output: Q&A with chairman Fei-Jain Wu |
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11 Jun 2009: | ACM Research finding strength in megasonic cleaning tool: Q&A with CEO David Wang |
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4 Jun 2009: | Killer app for the networked TV: Broadcom talks up OTT video |
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3 Jun 2009: | Kingston playing supportive role in Taiwan DRAM rescue: Q&A with company co-founder John Tu |
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2 Jun 2009: | Smartbooks vs netbooks: Q&A with Qualcomm senior VP Luis Pineda |
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| Nvidia's 5-year plan coming to fruition as GPU compute goes mainstream, Q&A with Ujesh Desai, vice president of product marketing |
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14 May 2009: | CIS market to see more consolidation: Q&A with Aptina marketing VP Sandor Barna |
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28 Apr 2009: | Applied Materials optimistic about a-Si thin-film PV |
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25 Mar 2009: | Globalfoundries already finding potential customers in Japan and Taiwan: Q&A with CEO Doug Grose |
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23 Mar 2009: | MEMS microphone market continues growing: Q&A with Akustica founder Michael E Elchik |
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2 Mar 2009: | Gearing up for 28nm FPGA: Q&A with Altera CEO John Daane |
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4 Feb 2009: | Expanding through acquisitions: Q&A with STMicro CEO Carlo Bozotti |
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21 Jan 2009: | Timing crucial to DRAM consolidation, says A-Data chairman Simon Chen |
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26 Dec 2008: | No gains can be expected from DRAM monopoly, says Kingston co-founder David Sun |
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22 Dec 2008: | Industry consolidation key to DRAM recovery: Q&A with PSC chairman Frank Huang |
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19 Dec 2008: | Taiwan DRAM deserves rescue: Q&A with ProMOS chairman ML Chen |
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15 Dec 2008: | Learning from Taiwan IC industry's marketing sensitivity: Q&A with China-based VeriSilicon CEO Wayne Dai |
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27 Nov 2008: | Efficiency, differentiation, time-to-market and localized service are keys to probe card success: Q&A with FormFactor CEO Mario Ruscev |
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26 Nov 2008: | Staying focused on wireless connectivity: Q&A with CSR CEO Joep van Beurden |
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13 Nov 2008: | Opportunity is always present in the midst of crisis: Q&A with Freescale CEO Rich Beyer |
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23 Oct 2008: | Solar energy market to grow at a very aggressive rate: Q&A with Gilad Almogy, senior vice president, Applied Materials |
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20 Oct 2008: | MEMS mass production to lead to increased foundry outsourcing: Q&A with Siimpel CEO Chee Kwan |
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9 Oct 2008: | Shrunken 65nm process is more competitive: Q&A with Kumi Higuchi, vice president of Elpida Memory |
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30 Sep 2008: | ARM-based MID products to hit the market in 2009: Q&A with Warren East, CEO of ARM |
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15 Sep 2008: | Semiconductor equipment localization – Don't act like a cry baby: Q&A with Hermes Epitek Archie Hwang |
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| Product difference and virtual localization: E-ton general manager talks about Taiwan's PV industry |
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12 Sep 2008: | Economic takes its spot next to technology: Talking techonomics with Synopsys CEO Aart de Geus |
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11 Sep 2008: | Economic and technology challenges moving to 32nm: Q&A with ATMI |
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| The state of the semiconductor industry: Q&A with SEMI president Stanley Myers |
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9 Sep 2008: | KLA Tencor sees the capex glass as half full |
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22 Jul 2008: | More outsourcing from IDMs implies business potential: Q&A with Global Testing president and CEO Paul Yang |
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18 Jul 2008: | If you can be number one in China you can be number one in the world: Q&A with Freescale senior VP Henri Richard |
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15 Jul 2008: | Opportunity and challenge in China semi inspection and metrology market: Q&A with KLA-Tencor China president Su Hua |
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11 Jul 2008: | Rohm & Haas ready for 18-inch wafer and new process migration: Q&A with president of microelectronic technologies James Fahey |
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25 Jun 2008: | From Hollywood to your digital life: Q&A with Dolby marketing vice president Francois Modarresse |
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18 Jun 2008: | No plan for 450mm wafer migration yet: Q&A with Chartered CEO Song-Hwee Chia |
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10 Jun 2008: | Daily silicon: Q&A with Gary Homan, VP of Hemlock Semiconductor |
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| Dr. Chii-Ming Yiin, Taiwan's Minister of Economic Affairs |
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9 Jun 2008: | Trends in storage, the economy and network: Comments from LSI CEO Abhi Talwalkar |
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| Trends in the Wi-Fi industry: An interview with Michael Hurlson of Broadcom |
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30 May 2008: | Profitability more important than ranking: Q&A with UTAC president and CEO JC Lee |
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21 May 2008: | A focused CMOS image sensor maker: Q&A with OmniVision sales VP Ray Cisneros |
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20 May 2008: | Distributing NXP ICs is "easy": Q&A with NXP Asia Pacific sales and marketing VP TL Chow |
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16 May 2008: | Well-positioned for an audio IC boom: Q&A with Wolfson CEO Dave Shrigley |
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14 May 2008: | Pursuit of a 100% on-year sales growth in 2008: Q&A with PTMD general manager Tom Lei |
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12 May 2008: | From ASIC to CSSP: Q&A with QuickLogic Greater China sales director David Kuo |
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24 Apr 2008: | A "Renaissance" in IC testing and packaging: Q&A with ASE R&D chief officer Ho-Ming Tong |
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23 Apr 2008: | Fair business environment necessary: Q&A with Tessera COO Mike Bereziuk |
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17 Apr 2008: | Hello Mr Chips: Q&A with former Korean Minister of Information amd Communication, Chin Dae-je |
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3 Apr 2008: | MEMS microphone is a business of dedication and diversification: Q&A with Akustica sales VP Michael E Elchik |
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28 Mar 2008: | Pursuit of market share and sales growth to be consistent: Q&A with Freescale sales and marketing senior VP Henri Richard |
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27 Mar 2008: | Handset demand growth in China promising: Q&A with NXP Greater China VP Stephen Lin |
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21 Mar 2008: | MEMS market growth to beat expectations: Q&A with TSMC mainstream technology business development director George Liu |
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18 Mar 2008: | Merger as key to growth: Q&A with GM of analog IC design house GMT |
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14 Mar 2008: | Silicon Laboratories expects strong growth in MCU business this year: Q&A with VP Derrell Coker |
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13 Mar 2008: | Snowstorms spur communications infrastructure demand in China: Q&A with Frank Liang, general manager of Greater China at Broadcom |
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12 Mar 2008: | China domestic demand still strong: Q&A with NXP regional executive for Greater China, Mike Yeh |
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11 Mar 2008: | Capacity expansion not the sole criteria to judge competitiveness: Q&A with Green Energy president Hurlon Lin, part II |
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26 Feb 2008: | Enhanced user experience at core of handset solution: Q&A with TI senior VP of wireless terminals business unit, Greg Delagi |
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22 Feb 2008: | Configurability, differentiation and margin: Q&A with ARC CEO Carl Schlachte |
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15 Jan 2008: | Providing a start-up platform for equipment localization: Q&A with Applied Materials |
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10 Jan 2008: | Persistent technology advancement to enable growth to beat industry average: Q&A with KLA-Tencor Taiwan GM |
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7 Jan 2008: | NXP-GloNav consolidation synergy to materialize as new solution to launch soon: Q&A with NXP EVP of mobile and personal business unit |
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25 Dec 2007: | Braving the storm in the NAND flash market: Q&A with 3S general manager Hu Ting-chung |
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12 Dec 2007: | Eyeing the China market: Q&A with David Sheu, chairman of equipment supplier Spirox |
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5 Dec 2007: | Gearing up for PV industry: Q&A with Applied Materials SVP Mark Pinto |
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26 Nov 2007: | Solar energy business an imperative: Q&A with CMO president Jau-Yang Ho |
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23 Nov 2007: | Treating every customer like Intel: Q&A with Tower CEO Russell Ellwanger |
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20 Nov 2007: | Aiming high: Q&A with Mike Yeh, NXP regional executive for Greater China |
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15 Nov 2007: | No conflict in handset chip market share and profitability: Q&A with STMicroelectronics COO Alain Dutheil |
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8 Nov 2007: | Differentiation the fundamental profit driver: Q&A with Rambus CEO Harold Hughes |
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23 Oct 2007: | Advent of pocket devices means opportunities for everyone: Q&A with Qualcomm UMTS product manager Mohit Bhushan |
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17 Oct 2007: | Acquisition of FCI bearing fruit: An interview with Silicon Motion president Wallace Kou |
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8 Oct 2007: | Brisk IC substrate and PCB sales to resume to normality in 2008: Q&A with Unimicron chairman Tze-Chang Tzeng |
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4 Oct 2007: | Stronger analog deployment, stronger foundries ties: Q&A with MIPS marketing VP Jack Browne |
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1 Oct 2007: | ASML reiterates direction on EUV: Q&A with KW Cheng, strategic sales and marketing VP of Asia Pacific |
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| Customer is the key for success: Q&A with TI Asia operation president Larry Tan |
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14 Sep 2007: | Looking beyond driver IC packaging and testing: Q&A with IST president Gray Huang |
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| Living in a material world: Q&A with IC material distributor Wahlee deputy CEO Chun-Yin Chen |
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| Use of ALD inevitable: Q&A with Aviza Technology president and CEO Jerry Cutini |
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13 Sep 2007: | Getting to know Terry Tsao: Q&A with the new SEMI Southeast Asia president |
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| Bonding with SUSS MicroTec: Q&A with Heinz Siegert, general manager of SUSS Taiwan |
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12 Sep 2007: | The state of the industry: Q&A with SEMI president Stanley Myers |
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11 Sep 2007: | What is next for Broadcom? 10-15% handset baseband market share by 2009: Q&A with Broadcom CEO Scott A McGregor, Part II |
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10 Sep 2007: | Mobile TV market to enter robust growth starting in 2010: An interview with Sangwoo Han, CTO of FCI |
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6 Sep 2007: | Second 12-inch fab and 32nm migration in the works: Q&A with Chartered CTO Simon Yang |
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3 Sep 2007: | What is next for Broadcom? 10-15% handset baseband market share by 2009: Q&A with Broadcom CEO Scott A McGregor, Part I |
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30 Aug 2007: | Transitioning from a "wafer-printing fab": Q&A with Silterra CEO Eg Kah Yee, part II |
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28 Aug 2007: | Added value key for R&D development: Q&A with Ulf Schneider, Infineon Asia Pacific Singapore development center VP |
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24 Aug 2007: | The niche and big niche for SSD: Q&A with Dean A Klein, Micron memory system development VP, part II |
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15 Aug 2007: | Turning weeks into days: Q&A with Berkeley Design Automation CEO Ravi Subramanian |
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8 Aug 2007: | Platform advancement in high gear: Q&A with Novellus dielectric group senior director product manager Julian Hsieh |
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30 Jul 2007: | A perfect spin-off: Q&A with NXP president and CEO Frans van Houten, part II |
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12 Jul 2007: | Controlling your future: Q&A with Arthur Lin, CEO of the Sunix Group |
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28 Jun 2007: | Late but focused: Q&A with Kingston NAND flash director, Darwin Chen, part II |
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| GPS applications in handsets to see explosive growth: Q&A with SiRF founder Kanwar Chadha |
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