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Tuesday 9 September 2025

DDI supply chain shakeup for Apple's iPhone puts LX Semicon at risk

China's BOE Technology is moving to diversify Apple's iPhone display driver IC (DDI) supply chain, a shift that threatens South Korea's LX Semicon, once a dominant and long-standing supplier in the market.

Tuesday 9 September 2025

Five years on, Taiwan's G2C positions local equipment makers at center of AI packaging shift

Soaring demand for AI computing is ushering the semiconductor sector into a fresh cycle of high-speed growth, pushing advanced packaging requirements to new heights. From infrastructure expansion to end-user applications, the ecosystem now relies heavily on precision technologies, with chip-on-wafer-on-substrate (CoWoS) processes at the forefront.

Tuesday 9 September 2025

Globalwafers chief warns materials, not process nodes, will decide chip industry's future

Speaking ahead of SEMICON Taiwan 2025, Globalwafers chairperson Doris Hsu said competition in semiconductors is shifting from process nodes and capacity to control of critical materials and supply-chain resilience, which she argued will decide future industry leadership.

Tuesday 9 September 2025

Aplex partners with Adirtek to enter CoWoS supply chain

Industrial PC (IPC) manufacturers have been actively expanding into new application markets in recent years, optimistic about the semiconductor industry's growing demand for full-process automation. Taiwan-based IPC maker Aplex Technology is strengthening its software capabilities in the semiconductor sector through investment in Adirtek. By also joining TSS Holdings, Aplex aims to leverage its comprehensive product lineup—including AI IPCs, human-machine interfaces, embedded hosts, edge computing, and AI software operation platforms—combined with Adirtek's system-level competitiveness to jointly penetrate the semiconductor industry supply chain.

Monday 8 September 2025

AI computing power reshapes global optoelectronics: 5,000 companies converge in Shenzhen for CIOE and SEMI-e shows

The 26th China International Optoelectronic Exposition (CIOE) will take place September 10–12, 2025, at the Shenzhen World Exhibition and Convention Center, alongside the International Semiconductor Exhibition & IC Industry Innovation Expo 2025 (SEMI-e). DIGITIMES will provide on-the-ground coverage in Shenzhen, with simultaneous English reporting on DIGITIMES Asia.

Monday 8 September 2025

Semicon Taiwan 2025 sets new records, focusing on AI, advanced packaging, and memory

SEMICON Taiwan 2025 will take place from September 10 to 12, 2025, at the Taipei Nangang Exhibition Center, bringing together over 1,200 global semiconductor and technology companies across 4,100 booths. The event is projected to attract more than 100,000 visitors, setting a new record in scale.

Monday 8 September 2025

Taiwan PCB makers pivot to AI servers amid China exodus

As the four major cloud service providers (CSPs) aggressively ramp up their presence in the AI computing market, Taiwan's printed circuit board (PCB) industry is experiencing a clear shift in demand. By 2025, orders for traditional servers are expected to give way to AI server demand, driving full-capacity utilization at leading server board makers such as Gold Circuit Electronics (GCE), Allied Circuit (ACCL), and First Hi-tec Enterprise (FHt).

Saturday 6 September 2025

GCE plans to expand Taiwan capacity with NT$1.6B purchase of CMC Zhongli plant

As demand for AI servers drives full production capacity, PCB manufacturer Gold Circuit Electronics (GCE) announced on September 5, 2025, that its board of directors approved a NT$1.6 billion (approx. US$52.4 million) investment to acquire an idle factory in Zhongli from optical disc maker CMC Magnetics (CMC). This site will serve as the company's reserve base for future capacity expansion in Taiwan.

Friday 5 September 2025

Asahi Kasei to double chip insulating material output by 2030 as AI data centers soar

Japan's semiconductor materials suppliers are racing to expand capacity as the AI data center build-out drives unprecedented demand for advanced chips and packaging inputs. Nikkei reports that Asahi Kasei will invest JPY16 billion (US$108 million) to double production of PIMEL, its photosensitive insulating material used in GPUs and other high-end semiconductors, by fiscal 2030.

Friday 5 September 2025

Taiwan PCB makers brace for mixed 2H25 as tariffs cloud demand

As the second half of 2025 ushers in the peak season for consumer electronics, Taiwanese PCB suppliers are preparing for new product launches from key clients like Apple. Despite ongoing global tariff disruptions, industry participants indicate that third-quarter stocking patterns remain largely consistent with previous years, with an expected operational improvement compared to the first half of the year.

Thursday 4 September 2025

Taiwan PCB supply chain tightens capex scale; leaders increase AI and SEA investments

Despite facing global end-market inventory adjustments and rising geopolitical uncertainties, Taiwan's printed circuit board (PCB) supply chain is shifting its capital expenditure atmosphere to accelerate positioning in emerging markets such as AI servers and high-performance computing (HPC). Led by global PCB leader Zhen Ding Tech and IC substrate giant Unimicron, these companies have announced expanded investment plans, betting on advanced AI applications and capacity layout in Southeast Asia.

Thursday 4 September 2025

China's SiC substrate industry faces setback, seeks strategic pivot

In early 2025, a leading Chinese third-category silicon carbide (SiC) substrate manufacturer faced international IDM customer complaints over product quality, triggering market concerns and cautious responses. Despite challenges abroad, the company refocused on China's domestic market, maintaining stable growth amid intense local price competition.

Thursday 4 September 2025

Tech Forum 2025: China's SiC surge leaves Wolfspeed struggling beyond bankruptcy

Wolfspeed's recovery from bankruptcy protection remains uncertain, with core problems expected to extend beyond its anticipated year-end exit. The US power semiconductor firm is struggling with weak yields in 8-inch silicon carbide (SiC) device production, while fast-growing Chinese competitors are undercutting its market share and earnings, DIGITIMES reported.

Wednesday 3 September 2025

Nittobo to triple T-Glass cloth capacity by 2027

Japanese fiberglass cloth giant Nitto Boseki (Nittobo) announced plans to invest JPY15 billion(US$101.87 million) to expand its production facilities to meet surging demand from AI server customers. The group will build a new factory equipped with advanced fiberglass fabric manufacturing capabilities. Production is expected to begin gradually, starting from the fourth quarter of fiscal year 2026 at the earliest, which ends March 2027.

Wednesday 3 September 2025

Why TSMC is holding back on advanced packaging despite soaring demand

TSMC's CoWoS capacity remains in high demand, securing its dominant position in advanced semiconductor packaging with rumored gross margins nearing 80%. However, TSMC is proceeding cautiously with its advanced packaging expansion due to three major considerations that require careful deliberation.

Wednesday 3 September 2025

Yageo receives Japanese approval to acquire Shibaura Electronics after national security review

Taiwan-based Yageo has secured approval from Japanese foreign direct investment (FDI) authorities to acquire Shibaura Electronics, following an extensive national security review. The clearance allows Yageo to move forward with its tender offer bid (TOB), advancing the US$740 million acquisition into its final stages.

Tuesday 2 September 2025

Nittobo's Fukushima bet shakes up CoWoS supply chain, Taiwan Glass on the line

The global surge in generative AI is driving explosive growth in the AI server market, making advanced CoWoS packaging a crucial battleground for GPU makers and custom chip developers. However, shortages of key upstream materials for IC substrates have created a chokepoint, forcing customers to scramble for supply.

Monday 1 September 2025

Taiwan's Co-tech to halt standard copper foil, double down on AI and 5G specialty demand

Co-tech Development is shifting further into high-performance copper foil for AI servers and 5G networks, confirming it will discontinue standard-grade foil production by early 2026. The transition comes as demand surges for high-frequency, high-speed ultra-low-profile (hyper very low profile; HVLP) copper foil used in copper-clad laminates (CCL), with supply already tight. Currently, only Mitsui Mining & Smelting of Japan and Taiwan-based Co-tech are the dominant global suppliers.

Monday 1 September 2025

TPCA Show to kick off in October with Unimicron chair as keynote speaker

The technology supply chain will gather for a series of exhibitions in the second half of 2025, including Taiwan's major PCB industry event, the TPCA Show, which will take place from October 22 to 24.

Monday 1 September 2025

APCB faces pressure after capacity reduction, eyes boost from DDR5, optical modules in 2026

Taiwan-based PCB manufacturer APCB is launching two new products in 2025, following significant capacity downsizing in 2024. However, the company noted that the new QSFP optical module boards and DDR5 R-DIMM memory module boards have yet to reach mass production, and their contribution to revenue remains limited. Contributions are expected to significantly increase in 2026, potentially becoming a key growth driver for the company's operations.

Saturday 30 August 2025

TSMC supplier AMC rewires its future with warpage-control materials after LCD collapse

Taiwan's LCD panel industry, which peaked at over NT$1 trillion in 2007, collapsed within years and became unprofitable. The decline pushed many optical materials suppliers to diversify. Alliance Material Co., Ltd. (AMC) pivoted in 2017 to advanced semiconductor packaging, focusing on the specialized field of warpage-control materials.

Friday 29 August 2025

AI demand and state backing lift China's semiconductor rally

Shares of Chinese semiconductor firms rallied after a wave of strong half-year earnings, highlighting how Beijing's AI push is reshaping the domestic chip landscape. On August 27, several STAR Market–listed chipmakers reported robust growth, with Cambricon Technologies briefly topping CNY1,460 (approx. US$204.1) a share — surpassing Kweichow Moutai, long viewed as China's benchmark for luxury and market value — to claim the crown as the most expensive A-share by unit price.

Friday 29 August 2025

Everlight Chemical banks on semiconductor materials

Everlight Chemical is maintaining a cautious outlook for the second half of 2025, with no expectations of recovering demand in the third quarter, but seeing a potential rebound in the fourth. However, the company's electronic chemicals segment shows promise for the latter half of the year, building upon its revenue and profit growth in the first half, with its current focus on semiconductor front-end process chemicals, photosensitive polyimides (PSPI) for back-end packaging, and low-temperature materials for displays.

Thursday 28 August 2025

Yageo confident of Shibaura acquisition approval after METI discussions

Yageo Corp. officially launched a public tender offer for Shibaura Electronics on May 9, 2025. Shibaura, a globally recognized manufacturer of negative temperature coefficient (NTC) thermistors, is noted for its strong technical capabilities.

Wednesday 27 August 2025

Nvidia's CoWoP PCB architecture targets ABF substrates but faces warpage risk

Nvidia's new advanced packaging technology, Chip-on-Wafer-on-Platform (CoWoP), has moved into testing with engineering samples of its base printed circuit boards (PCBs) under verification. Key suppliers involved in early development include Taiwan's Zhen Ding Technology Holding, Unimicron Technology Corp., and Compeq Manufacturing Co., along with China's WUS Printed Circuit (Kunshan) Co. and Victory Giant Technology (HuiZhou) Co.

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