GalaxyCore Inc. reported its 2024 earnings on April 28, posting annual revenue of CNY6.383 billion (approx. US$875 million), a 35.9% increase from the previous year. Net profit attributable to shareholders soared 287.2% to CNY187 million, while EBITDA rose 107.1% to CNY1.415 billion.
At its inaugural Intel Foundry Direct Connect 2025 event on April 29 in the US, Intel laid out its vision for reclaiming semiconductor leadership—anchored by next-generation 14A and 18A process nodes, advanced packaging integration, and a fortified ecosystem of design and manufacturing partners.
Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's semiconductor packaging equipment giant Kulicke & Soffa (K&S) has confirmed its close collaboration with Taiwan's semiconductor foundry leaders in the advanced packaging field for high-end chips.
Server suppliers confirm GB300 will retain the GB200's Bianca architecture, abandoning a planned redesign that promised expanded business for component makers.
STMicroelectronics offered a better-than-expected revenue forecast for the second quarter, suggesting a potential recovery in demand for automotive and industrial semiconductors. However, weaker-than-expected gross margin guidance and the absence of a full-year outlook tempered optimism, leaving analysts divided over whether the uptick reflects genuine demand or a short-term boost from tariff-related inventory moves.
