At the OCP Global Summit, Broadcom unveiled major advances in Co-Packaged Optics (CPO), claiming the technology has reached the maturity and reliability needed to transform next-generation AI compute clusters.
As TSMC prepares to release its latest financial results, investor optimism remains high despite renewed concerns over an AI bubble. Industry watchers continue to bet on generative AI as a key growth driver, propelling demand in the high-performance computing (HPC) sector and encouraging clients to steadily scale up chip orders with TSMC.
In a high-stakes bid to reclaim lost ground in the semiconductor arms race, Samsung Electronics has delivered early samples of its 2-nanometer application processor (AP) to Qualcomm, signaling a potential thaw in a once-close relationship fractured by past technical missteps. At the same time, Samsung is reportedly undercutting rival TSMC's pricing by as much as 33%, escalating tensions in the global foundry market just as the industry braces for the 2nm era.
