While many chipmakers remain cautious about market conditions heading into 2025—especially those outside the booming cloud AI sector—companies in the analog IC space are striking a more optimistic tone. From global IDM giants in the US and Europe to smaller regional players, industry sentiment has markedly improved in recent months.

AMD has unveiled a new lineup of next-generation AI processors and rack-scale system solutions, marking its most aggressive move yet to challenge Nvidia's dominant position in the accelerated computing market. The company was joined by several major cloud and infrastructure partners at the launch event, highlighting the growing industry alignment around UALink - an open-standard interconnect initiative aimed at countering Nvidia's proprietary NVLink ecosystem.

Canon's semiconductor business, best known for its photolithography equipment, is also bolstered by a range of specialized subsidiaries. One such unit, Canon Anelva, focuses primarily on thin-film deposition systems — a critical component in semiconductor manufacturing. Despite projections that the broader market will remain flat in 2025 compared to 2024, Canon Anelva expects to achieve more than 20% revenue growth, driven by two flagship product lines.

Broadcom is emerging as a key supplier in the artificial intelligence (AI) supply chain, with revenue from AI-related chips now comprising a majority of its semiconductor business.

The SEMI has announced the appointment of Tien Wu, Chief Operating Officer (COO) of ASE Group, as the new Chairman of its International Board of Directors. Wu will succeed Mary Puma, the Executive Advisor of Axcelis Technologies, in this prestigious role, where he will lead SEMI's global operations, oversee its talent development programs, and work toward fostering the collaborative goals of the semiconductor industry community.