Driven by the generative AI boom, Nvidia has solidified its dominance, capturing over half of the data center processor market. Its market share sits between 58% and 70%, depending on the calculation method used for revenues or shipment volumes.
SK Hynix is swiftly advancing in the High-Bandwidth Memory (HBM) arena, aiming to develop next-generation HBM that incorporates computing, communication, and other advanced functions. This strategic move is designed to leverage differentiated technologies, further extending its lead over competitors.
AMD has a close and solid relationship with TSMC on the 3nm technology, and the two companies are already working on several new product developments, according to Lisa Su, chairperson and CEO for the processor vendor.
Samsung Electronics' semiconductor division is under pressure, facing fierce competition from industry rivals and internal labor strikes, creating substantial hurdles for newly appointed chief Kye Hyun Kyung. Meanwhile, SK Hynix is capitalizing on its momentum, planning to significantly boost its 2024 capital expenditures to maintain its leadership in High-Bandwidth Memory (HBM).
MediaTek vice chairman & CEO Rick Tsai is set to discuss how MediaTek is driving the ubiquitous AI era during Computex 2024. Additionally, MediaTek will unveil two new chipsets: the Kompanio for high-end Chromebooks and the Pentonic 800 for 4K high-end smart TVs and displays. They will offer superior performance and AI computing capabilities in different application domains.
With a growing interest in the semiconductor sector, India is seeing a rise in startups that offer niche design solutions. One of them that has stood out lately is Bangalore-based FermionIC.
Lisa Su, CEO of AMD, unveiled today (June 3) at the Computex 2024 opening keynote address new leadership CPU, NPU, and GPU architectures that will enable end-to-end AI infrastructure spanning from the data center to PCs.
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging and testing facility at the Bandar Cassia Technology Park in Penang, Malaysia.
Announcing a US$47.5 billion funding for Phase 3 of the National IC Industry Investment Fund (the "Big Fund"), China's next move is under the eye of global chip players.
India is facing a talent shortage amid a growing semiconductor ecosystem. India's trading partners are concerned about India's import management system, which may be replaced by a stricter quota-based system in October.
