The US announced 25% to 100% tariff hikes on China-made EVs, batteries, semiconductors and other goods. Although the move does not impact South Korean industries for now, companies...
Major memory vendors Samsung Electronics, SK Hynix, and Micron Technology are fiercely competing to win orders for next-generation High-Bandwidth Memory (HBM) chips from Nvidia and...
Advanced Technologies & Solutions (AT&S), an Austria-based PCB and IC substrate manufacturer, has announced plans to sell its plant in Ansan, South Korea, which largely services...
The South Korean government is planning a comprehensive semiconductor investment support program, with a scale exceeding KRW10 trillion (US$7.304 billion). The aim is to strengthen...
Samsung Electronics and SK Hynix recently disclosed the orders and development of their High-Bandwidth Memory (HBM) products and have released optimistic comments for standard DRAM...
With the rise of AI, SK Hynix has successfully developed a new mobile NAND Flash solution called ZUFS (Zoned UFS) 4.0, targeting on-device AI applications.
With the rise of Artificial Intelligence (AI), the NAND flash market is experiencing significant growth. This has reignited the competition between Samsung Electronics and SK Hynix...
Samsung Electro-Mechanics (Semco) is reportedly expediting the development of its semiconductor packaging-use Glass Core Substrate (GCS) business by advancing the construction of...
Market research firm DSCC recently stated that for Apple's OLED iPad launched in 2024, LG Display (LGD) is expected to account for over 65% of the panel shipments, ahead of Samsung...
To take advantage of the rebound in the global monitor market in 2024, companies such as Samsung Electronics and LG Electronics are targeting high-performance, gaming, and AI demands...
As a subsidiary of SK Hynix, SK Hynix System IC is reportedly in the process of selling its equity in Wuxi, China. It is anticipated that in the future, SK Hynix System IC Wuxi will...
Samsung Electronics reportedly plans to dedicate separate development teams for next-generation High Bandwidth Memory (HBM) products, HBM3E and HBM4, to strengthen its competitiveness...
