TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
New products are insufficient to counteract the price declines of older products, causing IC design houses' gross margins to remain under pressure, according to industry sources.
IC verification lab Materials Analysis Technology (MA-tek) plans to allocate NT$1.2 billion (US$38.6 million) in capital expenditures for 2023, of which nearly 80% will be used to...
Intel held the Intel Internal Foundry Model Investor Webinar on June 21 to explain the shift to a new internal foundry model, where internal product departments and manufacturing...
Tyntek, a manufacturer of LED chips and Si-based sensors, is expected to see the losses of its core business narrow in the second quarter, even though it has adjusted lower the prices...
