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NEWS TAGGED ADVANCED PACKAGING
Friday 17 May 2024
Intel steps up equipment and material orders for advanced packaging
Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into...
Tuesday 14 May 2024
Semiconductor materials orders driven by advanced processes, packaging demand
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
Tuesday 14 May 2024
CPO promises to have presence in semiconductor advanced packaging
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
Friday 10 May 2024
Rapidus gears up for advanced packaging and chiplet technologies as it races to 2nm production
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
Monday 6 May 2024
Southeast Asia and Japan attract OSAT interest amid geopolitical diversification
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
Friday 3 May 2024
Japan takes ambitious action on advanced packaging technology to capture Chiplet and AI chip opportunities
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Tuesday 30 April 2024
Fab toolmakers see order visibility from TSMC extended to 2025
Equipment makers have seen the visibility of TSMC's order extended to 2025, and Intel and OSATs have also placed orders, according to industry sources in Taiwan.
Friday 26 April 2024
ASEH likely to raise 2024 capex; US production line possible
ASE Technology Holding (ASEH) may boost its capex in 2024 due to increased spending on advanced packaging and testing capabilities. The Taiwan-based OSAT also does not rule out developing...
Thursday 25 April 2024
TSMC debuts A16 technology at 2024 North America Technology Symposium
At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI...
Thursday 25 April 2024
India-based Kaynes eyes advanced packaging and CPO in OSAT foray
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself...
Tuesday 23 April 2024
Samsung's 2.5D packaging still has last mile to cross before getting Nvidia orders
Although Samsung has been the subject of market rumors regarding Nvidia's placement of its 2.5D packaging orders, industry sources recently said there is no information regarding...
Monday 22 April 2024
Advanced packaging still in short supply; production expansion spreading overseas
TSMC's advanced packaging CoWoS capacity continues to have strong demand. Even after doubling its capacity in 2024 and collaborating with OSAT companies, it can still not fully meet...
Friday 19 April 2024
TSMC lowers 2024 semiconductor, foundry outlook
Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...
Thursday 18 April 2024
IC backend firms to embrace strong 2H24
ASE Technology Holding (ASEH) and other Taiwan-based IC backend houses are gearing up for a prosperous second half of 2024, stepping up their capacity expansion pace, according to...
Monday 15 April 2024
Samsung gets US$6.4 billion from CHIPS Act, promises to bring HBM and advanced packaging to Texas
The US Department of Commerce (DOC) and Samsung Electronics signed a non-binding preliminary memorandum of terms (PMT) on April 15 to provide up to US$6.4 billion in direct funding...