Samsung Electronics has reportedly become the largest supplier of mobile DRAM for Apple's iPhone 17, a trend expected to continue with the upcoming iPhone 18. Industry analysts attribute this shift to SK Hynix and Micron recently focusing their production capacity on AI-targeted high-bandwidth memory (HBM), prompting Apple to rely more heavily on Samsung's ample general DRAM output to secure supply.

Despite approaching the end of the year and the promotional peak season coming to an end, overall utilization rates in the smartphone panel market have remained relatively high. Additionally, differences in market conditions and structures among panel technologies have led to mixed price movements.

The global telecommunications equipment market is entering a period of profound change. As the technological roadmap for 6G increasingly points toward non-terrestrial networks, or NTN, the future of base stations may no longer be grounded on Earth. Instead, they could be deployed in space, mounted directly on satellites.

Apple is poised to surpass Samsung Electronics in global smartphone shipments in 2025, marking its first return to the top spot in 14 years. Meanwhile, Samsung's smartphone business, once a key revenue pillar during downturns in its semiconductor division, is reportedly showing signs of strain amid rising costs and intensifying competition.

According to Yonhap News and The Korea Herald, Samsung Electronics has posted a full specification sheet for its mobile application processor (AP), the Exynos 2600, on its official website. The Exynos 2600 was designed by Samsung Semiconductor's Device Solutions (DS) division under the System LSI business unit and manufactured using the company's most advanced 2nm process based on Gate-All-Around (GAA) technology. With the specifications now public, the industry's first 2nm mobile AP is expected to attract increased attention from the tech sector.

As memory shortages and price increases extend through 2026, smartphone companies are considering downgrading memory capacities in their devices. Despite this, Jacob Chen, president of Samsung Taiwan's Mobile Communications Division, stated that Samsung's vertically integrated structure across the supply chain allows the company to benefit from memory shortages, supporting stronger smartphone sales. He expects Taiwan's smartphone sales volume in 2026 to continue growing and confirmed that Samsung currently has no plans to reduce memory capacities in its devices.

Research institutions predict that global smartphone shipments could decline by 1–2% in 2026 due to memory shortages, with mid- and low-range devices expected to be most affected. Based on the Bill of Materials (BOM), the proportion of memory in total component costs varies by device tier. High-end smartphones allocate roughly 15% of component costs to memory, while mid- and low-range devices account for approximately 25–35%.

China's 3C market has been reporting successive price hikes despite a sluggish macroeconomic environment and deflationary pressure. Xiaomi, followed by Honor, Lenovo, and Dell, have increased prices, demonstrating the impact of memory shortages on the 3C end market.

Samsung Electronics' newly launched tri-fold smartphone, the Galaxy Z Tri Fold, has generated robust initial demand despite concerns over its steep repair fees. The device sold out within five minutes of going on sale on Samsung's official website and is currently available only through restock notifications.

Based on estimates from third-party market research firms, small- and medium-sized panel maker HannStar Display stated that the 2026 panel market is expected to be relatively stable, with annual growth of around 2–3% and no major fluctuations. However, recent sharp increases in memory prices and tight supply have crowded out resources across the broader electronics industry, which could further affect panel demand, especially in notebooks and smartphones.